Robustness of a package is often proven by performing temperature cycling tests. Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remains a major concern for the reliability of semiconductor components. This issue is usually addressed by exposing the component to a certain number of cycles, followed by e.g. scanning acoustic microscopy (SAM) to investigate delamination. Discussions about specific cycling conditions, e.g. using -65°C/+175°C instead of -55°C/+150°C for the minimum and maximum temperatures of the cycles or even using liquid-liquid cycling instead of air to air to speed up investigations [1], are often moot, because no real understanding of the effect of the cycling conditions on the component is available
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.