A characteristic feature of LTCC is good workability. In some cases a LTCC‐based microsystem can be a good alternative to microsystems made in silicon or other technologies. Reasons for choosing LTCC‐Technology may be financial considerations or specific material properties. A main problem is to simplify a mechanical component in such a way, that it is possible to integrate this component in a planar structure with a small height in consideration of the restrictions of the LTCC‐Technology. In contrast to LTCC‐based substrates with only electrical circuits the integration of mechanical components make other demands on the different technological steps of the LTCC‐Process. In this paper some 3D‐structures made in LTCC‐like fluidic channels, membranes usable for micropumps or pressure sensors – and some aspects of required special technological demands are described.

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A novel recording scheme which combines optical-recording track widths with magnetic-recording linear transition densities is conceptually described. The system uses a magnetic transducer to both record and read information, but track width definition and track following are accomplished with a focussed laser beam, as in optical recording. Area recording densities of (1–3)×108 bits/cm2 appear possible. Several possible implementations of the method are presented and their advantages and disadvantages are discussed.

CiS Research Institute for Micro-Sensors and Photovoltaics is an R&D service provider that carries out the development of micro-sensor solutions from system design to prototyping for industrial enterprises. The main focus of the actual assembly and packaging development is the miniaturisation of smart sensor systems. Three-dimensional integration is a promising solution to meet this goal. New materials in combination with flip-chip techniques can help to realize such modules. But high demands for long-term stability of the electrical signal quality have to conform to demands for smaller size of the complete module. However, the mismatch of thermo-mechanical properties in stacks combined of different materials leads to stress during assembly and lifetime. This limits the reliability and signal stability of such sensor systems. Endurance tests in combination with finite element analyses of deformation and inner strains can help to understand the influence of material prop erties and to optimise design and assembly processes. Additional use of MicroDAC (Micro Deformation Analysis by means of Correlation [1]) stress chips is possible. With this kind of in-situ measurement it is possible to verify simulation results and optimise thermal processes of assembly. Results of measurements and simulation show the way to create low stress packages and improve lifetime as well as signal stability. Especially chips made of new LTCC materials with adapted CTE [2] show advantages. The investigation can help to adjust design and processing of mixed materials stacks for sensor applications

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