This paper reports theoretical and experimental methods for drilling alumina ceramic substrates by using a nanosecond-pulsed ultraviolet laser. A physical model was established using ANSYS parameter design language finite element software. The influence of laser parameters, such as laser fluence, number of pulses and its duration, and frequency, on morphology-depth, diameter, taper, and temperature distribution-was investigated using three-dimensional confocal laser scanning microscopy. Simulation and experimental results reveal that higher laser fluence and number of pulses produces larger drilling depths and diameters. Laser fluence, pulse duration, frequency, and pulse number of 5.10 J/cm 2 , 1000 μs, 20 kHz, and >9, respectively, can successfully drill through the alumina ceramic substrate. Pulse duration between 3 and 8 ms yielded the smallest hole taper.

In this study, we worked on the formation of micro through holes in multi-component glass substrates using laser-assisted etching, in which mixed aqueous solutions of hydrofluoric acid (HF) and nitric acid (HNO 3 ) were used for the etching. Glass samples modified by femtosecond laser irradiation were immersed for 10 minutes in aqueous solutions containing 2% HF and between 0 and 32% HNO 3 . The subsequent optical microscope observations and measurements showed that the highest etch selectivity, which was 21, was obtained with an etch solution containing 6% HNO 3 . Furthermore, through holes with diameters approaching 20 μm were successfully formed in a 100 μm thick glass substrate without any cracks using the mixed solution.

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