A theoretical analysis and experimental verification of a laser drilling process for a ceramic substrate

Chen, Mingfei; Hsiao, Wen‐Tse; Wang, Ming Cheng; Yang, Kai; Chen, Ying Fang

doi:10.1007/s00170-015-7219-7

Cited by 26 publications

(6 citation statements)

References 17 publications

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“…As the number of scans increased, the inlet diameter of the through-hole first increased to saturation, and the outlet diameter gradually increased to a stable state. During laser processing, the diameter of the laser spot was constant, and the size of the material ablation area was constant, which ultimately leads to a constant diameter of the micro hole [20] . As the scanning times increased, the taper of the prefabricated hole increased sharply and then decreased to a stable state.…”

Section: Effect Of Scanning Numbers On Taper Of Prefabricated Holementioning

confidence: 99%

Feasibility study of laser and in-situ ECM of array holes

Shao

Yang

Wang

et al. 2022

Seventeenth National Conference on Laser Technology and Optoelectronics

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Aiming at the issues of low machining efficiency and difficulty in keeping consistency of machining accuracy of micro array holes with high surface quality. This paper proposed a laser and in-situ electrolytic machining technology for processing array holes, which utilized the advantages of high laser machining efficiency and good surface quality electrochemical machining (ECM). Firstly, laser was used to perform high-efficiency drilling of prefabricated micro array holes on workpieces that was covered with insulating layer, and then the recast layer and taper of prefabricated holes were removed by ECM. To verify the feasibility of the proposed method, laser prefabricated of the array holes with the diameter of 0.8 mm and the in-situ electrolytic recast layer removal were carried out on the Inconel 718 workpiece. Influences of laser scanning speed, defocusing distance, scanning times and insulating plate thickness on the taper of prefabricated hole were investigated experimentally. The optimized laser processing parameters were as follows: scanning speed 60 mm/s, defocusing distance 1.5 mm, scanning times 50, and insulating plate thickness 0.4mm. Results of in-situ ECM showed that the recast layer on the surface of the laser processed holes could be removed, indicating that the laser and in-situ ECM could achieve high efficiency and high precision machining of micro array holes without recast layer.

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Section: Effect Of Scanning Numbers On Taper Of Prefabricated Holementioning

confidence: 99%

Feasibility study of laser and in-situ ECM of array holes

Shao

Yang

Wang

et al. 2022

Seventeenth National Conference on Laser Technology and Optoelectronics

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“…The model considered for the analysis closely follows the experimental set-up so that the boundary conditions and dimensions are sufficient for simulating the laser drilling process [10,15]. Following are the assumptions made for analysing the laser drilling of Ti6Al4V [10,15,31,32].…”

Section: Numerical Modelmentioning

confidence: 99%

An experimental study on drilling of titanium alloy using CO2 laser

et al. 2018

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Laser drilling is a popular method as it eliminates the problem of chatter and vibration due to the absence of physical contact between the tool and workpiece. Tool breakage, a common phenomenon that occurs due to bending of the tool in making of slender holes using conventional drilling, can also be avoided. However, quality of the hole measured in terms of circularity, taper and spatter area is the major concern during laser drilling. The present investigation attempts to find out the optimum parametric setting during drilling of Ti6Al4V using CO 2 laser in order to achieve quality holes. Experiments have been conducted to assess the influence of machining parameters, viz. flushing pressure, laser power and pulse frequency, on the performance characteristics such as taper of kerf, heat-affected zone (HAZ) and spatter area. Taguchi's L 9 orthogonal array has been used to design the experimental layout as it reduces the experimental cost and time. Analysis of variance has been performed to assess the effect of machining parameter on the performance characteristics. It has been observed that laser power has significant influence on taper of kerf, HAZ and spatter area. Based on desirability approach, the study suggests that all the performance characteristics can be simultaneously optimized at flushing pressure of 40 Pa, laser power of 2250 W and pulse frequency of 1600 Hz. The study also presents a numerical model to simulate the laser drilling process. Since comparison of experimental and numerical model shows a relative error within 10%, adequacy of the numerical model for assessment of quality characteristics of laser drilled holes is justified.

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“…The number of pits on the drilling surface is the largest which shows that brittle fracture is the dominant removal manner. A large number of crystalline grains and crystalline grain blocks fell off from the drilling surface in the form of cutting chips and formed pits under the action of drilling and impact load [25], as shown in Fig. (5).…”

Section: Brittle Fracture Removal Of Sic Ceramicmentioning

confidence: 99%

Drilling Mechanism Investigation on SiC Ceramic Using Diamond Bits

Gao¹,

Wu²,

Wang³

2017

TOMEJ

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Background: SiC ceramic have been widely used in the fields of armor protection, but SiC ceramic is one of the difficult-to-machine material for its high hardness and low fracture toughness. Objective: This paper presents an investigation of drilling mechanism on SiC ceramic using diamond bits. Method: Based on the theory of indentation fracture mechanics model, cutting average load model and cutting average depth model for single particle were established, theory analysis of drilling mechanism was carried out; through scanning electron microscope (SEM) observation, experimental removal mechanism was discussed. Results and Conclusions: The results show that, brittle fracture is the dominant way for SiC ceramic’s removal mechanism, plastic deformation always exists during the drilling process. Brittle fracture includes cleavage fracture, transgranular fracture, intergranular fracture, material peeling off and grain boundary breakage; resintering and recrystallization happen under the joint action of grinding forces and grinding heat in the contact area, where plastic flow characteristics also appear; powdering removal is accompanied by the drilling process; cleavage fracture and transgranular fracture occur on intergranular pores and grain boundary; residual cracks are found in the drilling surface resulted by drilling stress and high temperature.

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A theoretical analysis and experimental verification of a laser drilling process for a ceramic substrate

Cited by 26 publications

References 17 publications

Feasibility study of laser and in-situ ECM of array holes

Feasibility study of laser and in-situ ECM of array holes

An experimental study on drilling of titanium alloy using CO2 laser

Drilling Mechanism Investigation on SiC Ceramic Using Diamond Bits

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