Electronically active yarn (E-yarn) pioneered by the Advanced Textiles Research Group of Nottingham Trent University contains a fine conductive copper wire soldered onto a package die, micro-electro-mechanical systems device or flexible circuit. The die or circuit is then held within a protective polymer packaging (micro-pod) and the ensemble is inserted into a textile sheath, forming a flexible yarn with electronic functionality such as sensing or illumination. It is vital to be able to wash E-yarns, so that the textiles into which they are incorporated can be treated as normal consumer products. The wash durability of E-yarns is summarized in this publication. Wash tests followed a modified version of BS EN ISO 6330:2012 procedure 4N. It was observed that E-yarns containing only a fine multi-strand copper wire survived 25 cycles of machine washing and line drying; and between 5 and 15 cycles of machine washing followed by tumble-drying. Four out of five temperature sensing E-yarns (crafted with thermistors) and single pairs of LEDs within E-yarns functioned correctly after 25 cycles of machine washing and line drying. E-yarns that required larger micro-pods (i.e., 4 mm diameter or 9 mm length) were less resilient to washing. Only one out of five acoustic sensing E-yarns (4 mm diameter micro-pod) operated correctly after 20 cycles of washing with either line drying or tumble-drying. Creating an E-yarn with an embedded flexible circuit populated with components also required a relatively large micro-pod (diameter 0.93 mm, length 9.23 mm). Only one embedded circuit functioned after 25 cycles of washing and line drying. The tests showed that E-yarns are suitable for inclusion in textiles that require washing, with some limitations when larger micro-pods were used. Reduction in the circuit’s size and therefore the size of the micro-pod, may increase wash resilience.

Electronic yarns (E-yarns) contain electronics fully incorporated into the yarn’s structure prior to textile or garment production. They consist of a conductive core made from a flexible, multi-strand copper wire onto which semiconductor dies or MEMS (microelectromechanical systems) are soldered. The device and solder joints are then encapsulated within a resin micro-pod, which is subsequently surrounded by a textile sheath, which also covers the copper wires. The encapsulation of semiconductor dies or MEMS devices within the resin polymer micro-pod is a critical component of the fabrication process, as the micro-pod protects the dies from mechanical and chemical stresses, and hermetically seals the device, which makes the E-yarn washable. The process of manufacturing E-yarns requires automation to increase production speeds and to ensure consistency of the micro-pod structure. The design and development of a semi-automated encapsulation unit used to fabricate the micro-pods is presented here. The micro-pods were made from a ultra-violet (UV) curable polymer resin. This work details the choice of machinery and methods to create a semi-automated encapsulation system in which incoming dies were detected then covered in resin micro-pods. The system detected incoming 0402 metric package dies with an accuracy of 87 to 98%.

Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible yarn that incorporates electronic components within the fibres of the yarn (E-yarn). The production of these novel E-yarns was initially a craft skill, with the inclusion of package dies within the fibres of the yarn taking about 90 min. The research described here demonstrated that it is possible to produce E-yarns on an industrial scale by automating the manufacturing process. This involved adapting printed circuit board manufacturing technology and textile yarn covering machinery. The production process started with re-flow soldering of package dies onto fine multi-strand copper wire. A carrier yarn was then placed in parallel with the copper wire to provide tensile strength. The package die and adjacent carrier yarn were then encapsulated in a polymer micro-pod to provide protection from moisture ingress and from mechanical strain on the die and solder joints. The process was then completed by surrounding the micro-pod and copper interconnects with additional fibres, held tightly together with a knitted fibre-sheath. This prototype, automated production process reduced the time for embedding one micro-device within a yarn to 6 min, thus increasing the production speed, demonstrating that automation of the E-yarn production process is feasible. Prototype garments have been created using E-yarns. Further developments can include automated transfer of the yarn components from one stage of production to the next, enabling greater increases in speed of manufacture of E yarns.

Over the past few years, alternative power supplies to either supplement or replace batteries for electronic textile and wearable applications have been sought, with the development of wearable solar energy harvesting systems gaining significant interest. In a previous publication the authors reported a novel concept to craft a yarn capable of harvesting solar energy by embedding miniature solar cells within the fibers of a yarn (solar electronic yarns). The aim of this publication is to report the development of a large-area textile solar panel. This study first characterized the solar electronic yarns, and then analyzed the solar electronic yarns once woven into double cloth woven textiles; as part of this study, the effect of different numbers of covering warp yarns on the performance of the embedded solar cells was explored. Finally, a larger woven textile solar panel (510 mm × 270 mm) was constructed and tested under different light intensities. It was observed that a PMAX = 335.3 ± 22.4 mW of energy could be harvested on a sunny day (under 99,000 lux lighting conditions).

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