The process–structure–property relationships of copper laser powder bed fusion (L-PBF)-produced parts made of high purity copper powder (99.9 wt %) are examined in this work. A nominal laser beam diameter of 100 μm with a continuous wavelength of 1080 nm was employed. A wide range of process parameters was considered in this study, including five levels of laser power in the range of 200 to 370 W, nine levels of scanning speed from 200 to 700 mm/s, six levels of hatch spacing from 50 to 150 μm, and two layer thickness values of 30 μm and 40 μm. The influence of preheating was also investigated. A maximum relative density of 96% was obtained at a laser power of 370 W, scanning speed of 500 mm/s, and hatch spacing of 100 μm. The results illustrated the significant influence of some parameters such as laser power and hatch spacing on the part quality. In addition, surface integrity was evaluated by surface roughness measurements, where the optimum Ra was measured at 8 μm ± 0.5 μm. X-ray photoelectron spectroscopy (XPS) and energy-dispersive X-ray spectroscopy (EDX) were performed on the as-built samples to assess the impact of impurities on the L-PBF part characteristics. The highest electrical conductivity recorded for the optimum density-low contaminated coils was 81% IACS.

Due to its exceptional electrical and thermal conductivity, pure copper is frequently employed in industry as the base metal for thermal management and electromagnetic applications. The growing need for complicated and efficient motor designs has recently accelerated the development of copper additive manufacturing (AM). The present work aims to improve the power density of the copper laser powder bed fusion (Cu-LPBF) coil by increasing the slot-filling factor (SFF) and the electrical conductivity. Firstly, the dimensional limitation of Cu-LPBF fabricated parts was identified. Sample contouring and adjusting beam offset associated with optimum scan track morphology upgraded the minimum feature spacing to 80 μm. Accordingly, the printed winding’s slot-filling factor increased to 79% for square wire and 63% for round wire. A maximum electrical conductivity of 87% (IACS) was achieved by heat treatment (HT). The electrical impedance of full-size Cu-LPBF coils, newly reported in this study, was measured and compared with solid wire. It can reflect the performance of Cu-LPBF coils (power factor) in high-frequency applications. Furthermore, surface quality benefited from either sample contouring and HT, where the side surface roughness was lowered by 45% and an additional reduction of 25% after HT.