Prior studies on small and medium sized enterprises (SMEs) in Malaysia have focused on performance with inconclusive results. This paper contributes to the literature by examining variation in performance resulting from the synergistic role of entrepreneurial orientation, government support and internalization. It primarily explores three main industries: manufacturing, service and agriculture, generating data from 218 self-administered questionnaires. Using the Partial Least Squares (PLS) regression in testing the proposed hypothesis, it was uncovered that the mediating effect of internationalization between entrepreneurship orientation and firm performance was insignificant. In contrast, Government support was seen as a stronger predictor of firm performance. Furthermore, internationalization was shown to only partially mediate government support and firm performance. This study emphasizes the importance of Government support and will aid stakeholders in developing a robust understanding of the role of key factors in shaping SME performance in the global market.

Many studies have revealed about Internet use and Internet addiction. Most research focuses on the jeopardy and opportunities about active Internet usage however very limited empirical research emphasis on the role of parents in this context. Hence, this research paper explored the parenting styles and parental attachment in overcoming Internet addiction among children in Klang Valley, Malaysia. The parenting styles model and attachment theory have been used in this research. The Internet has created a new platform for the development of children, which offers various possibilities and also difficulties. Malaysian children are actually very in need to be safe during online thus, parents are encouraged to play their parental role in preparing their children to become better digital citizens.

Warpage on the backside of silicon wafer after thinning process is examined. The thinning process includes back-grinding (BG) and wet chemical etching (WCE). Results of wafer warpage were compared to sub-surface damage from Transmission Electron Microscopy (TEM) analysis and showed that sub-surface damage on the backside of the silicon 100 would induce high wafer warpage, and reduced wafer strength. Further studies from surface roughness and topography of each surface finish is obtained by Atomic Force Microscopy (AFM) and SEM show that low surface roughness is in accordance with smooth surface condition, which comes after the wet etching process.

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