No abstract

Pixelated LEDs are a new, high efficient light source which allows to control the beam pattern and which are therefore suitable for adaptive front light systems. We will present a concept for hybrid 3D flip chip stacking of pixelated LED chips onto an active matrix driver IC using a new interconnect structure to address thermal management and bonding robustness challenges. Two types of interconnect materials have been investigated: electroplated AuSn solder and nanoporous gold (NPG). We will present the deposition methods and the bonding approach for chip-to-chip and chip-to-wafer bonding and the characteristic results of the bonded interconnects achieved