With a measurement technique called television holographic interferometry, we investigated the internal stress generated at the initial deposition stage in electrolessly deposited Cu films on silicon substrates. In a region of film thickness less than 100 nm, two inflection points, at which the direction of stress was reversed, were observed on the film thickness-stress curve. From crosssectional transmission electron microscopy observation of these films, it was found that the films grew in the Volmer-Weber mode and that the above inflection points related to specific stages observed, such as islands growth, islands coalescence, the formation of continuous film, and grain growth.As thin solid films for practical use in microelectronics become thinner, the adherence of these films at the initial deposition stage has attracted attention. 1-4 Elucidation of the generation mechanism of the intrinsic stress is indispensable for improving the adherence of the films. Stress measurement at the initial deposition stage of various thin films has been suggested in the field of the dry process ͑physical vapor deposition, PVD͒. 5,6 In connection with this, we have already developed an in situ measurement technique for initial internal stress by television holographic interferometry and applied this technique to the wet deposition process ͑plating͒. 7 In this study, we aimed at relating the internal stress of electrolessly deposited Cu films on silicon substrates to the microstructure of the matching films revealed by cross-sectional transmission electron microscopy ͑TEM͒ observation. Figure 1 shows the optical apparatus for TV holographic interferometry. The incident Ar laser beam ͑ = 488 nm͒ is split into two beams, a reference beam to the charge-coupled device ͑CCD͒ camera and an object beam to the plating bath. The end deflection of the substrate is calculated from interference fringes imaged from the phase contrast between the reference beam and the object beam reflected by the reverse side of the substrate. The internal stress in the deposited film is obtained from Stoney's equation
Experimentalin which E s is Young's modulus of the substrate, T is the substrate thickness, ␦ is the substrate end deflection, L is the substrate length, D is the film thickness, and s is Poisson's ratio of the substrate. The total energy required for deformation of the substrate is obtained by using the following equationin which G in is the internal strain energy of deposited film proportional to the substrate end deflection ␦. As the substrate for deposition, the test strip with dimensions of 120 mm in length, 7 mm in width, and 0.1 mm in thickness made from a silicon wafer ͓E&M, CZ,͑100͒, E s : 170 GPa, s :0.25͔ was used. Pd films with a thickness of 10 nm serving as a catalytic layer were deposited on Si substrates by electron beam vapor deposition. The plating solution consisted of 0.008 M copper sulfate ͑CuSO 4 ·5H 2 O͒, 0.24 M formaldehyde ͑HCHO, 37%͒, 0.14 M tetrasodium ethylenediaminetetraacetate ͑EDTA-4Na͒ was used for examination...