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The present paper describes the effect of the rolling direction on the quality of microchannels manufactured using photochemical machining (PCM) of Monel 400. Experiments were carried out to fabricate microchannels along and across the rolling direction to investigate the effect of the grain orientation on microchannel etching. The input parameters considered were channel width and rolling direction, whereas the depth of etch was the response parameters. Different channels of widths of 60, 100, 150, 200, and 250 μm were etched. The effects of the etching time and temperature of the etchant solution on the undercut and depth of the microchannels were studied. For good quality microchannels, the effects of spinning time, spinning speed, exposure time, and photoresist film strength were also taken into consideration. Optimized values of the above were used for the experimentation. The results show that the depth of etch of the microchannel increases more along the rolling direction than across the rolling direction. The channel width and depth are significantly affected by the etching time and temperature. The proposed study reports an improvement in the quality of microchannels produced using PCM.

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Photochemical Machining is a novel machining process capable of processing wide range of hard-to-machine materials. This research addresses modelling and optimization of the process parameters for this machining technique. To model the process a set of experimental data has been used to evaluate the effects of various parameter settings in machining of SS316L. The process variables considered here include etchant temperature, time and concentration. Undercut, as one of the most important output characteristics, has been evaluated based on different parameter settings. The full factorial method and regression modelling are used in order to establish the relationships between input and output parameters. The effect of control parameters on undercut was analysed using Analysis of Variance (ANOVA) technique and their optimal conditions were evaluated. It was found that etchant temperature and etching time are the most significant factors for undercut.