Analyzing the wetting behavior of silver on a diamond substrate is crucial prior to joining and printing diamond chips in electronics, bioimplants, and cutting tool industries. This paper used molecular dynamics models to overcome the hydrophobic behavior. It was observed that the hydrophilic character was well promoted when a nanosolder block of silver was collided at a certain velocity on a diamond substrate in a hydrodynamic state rather than when it was stationary and then heated on diamond. Hydrodynamic wetting led to rapid spreading, which in turn elucidated a high rate of change in contact area to the highest 11 832 Å2 and a high rate of decrease in contact angle to the lowest 23° at the highest contact velocity of 19.7 km/s in minimum time. Therefore, hydrodynamic wetting has a leading margin for silver coating on diamond surfaces over temperature, slab separation, and hydrostatic wetting. This paper provides theoretical insights for effective thin-film development in the least possible time and with the lowest solder consumption.