Microstructural evolution during elevated temperature annealing of sputter deposited copper (Cu) films was investigated by electron backscatter diffraction (EBSD). Analysis of films was performed both in situ using a heating stage, and by ex-situ observation of microstructural evolution. It was noted that not only is the Cu film texture and grain size a function of film thickness, but also that the fraction of twin boundaries present in the material is strongly dependent upon film thickness. This is explained by means of a simple model that considers the energy of the system. Surface and interface energies, as well as grain boundary energies for random high angle boundaries and for twin boundaries (both coherent and incoherent planes) are used in the determination. The model was shown to accurately predict the twin boundary size in self-annealed films. This type of analysis also results in a texture map similar to that presented by Thompson, 12 but incorporates the development and effect of twin boundaries, so that additional texture components (in addition to 111 and 100 fibers) are included.

In order to make a high quality color cathode ray tube, the influence of the texture on the etching property of an invar (Fe-36%Ni) shadow mask sheet has been studied. For the etching property, new values (gR-, aRvalue) are presented which are estimated with the intensity of the inverse pole figure for the normal direction of the sheet. Furthermore, for the decision of the etching property, RD-values which are calculated with ODF are suggested. A good etching property is obtained when the RD-value is more than 2.

Error quantities, defined earlier to estimate the accuracy of texture measurement, are used to define a probability criterion for correct indexing of powder diffraction diagrams. The criterion is based on the compatibility of pole density distribution functions of different (hkl) depending on the directions {θ,γ}(hkl) of the reciprocal lattice vectors r*(hkl). The criterion was applied to permutation of the indices and variation of the angles {θ,γ}(hkl) in the vicinity of the correct values. In fortunate case, these angles can be determined within a few degrees by minimizing the error quantities. The method works very well with strong textures but it is still applicable if only weak textures can be achieved. The method was tested with different crystal symmetries including cubic, hexagonal, orthorhombic, and monoclinic. It is concluded that the criterion can be successfully applied to all crystal symmetries. If a measuring technique based on a position sensitive detector is used, even multifold peak superpositions in tilted sample orientations can be resolved. The method can also be applied if some (hkl) cannot be separated experimentally.