A subdermally implantable flexible photovoltatic (IPV) device is proposed for supplying sustainable electric power to in vivo medical implants. Electric properties of the implanted IPV device are characterized in live animal models. Feasibility of this strategy is demonstrated by operating a flexible pacemaker with the subdermal IPV device which generates DC electric power of ≈647 μW under the skin.

Physiological signals provide important information for biomedical applications and, more recently, in the form of wearable electronics for active interactions between bodies and external environments. Multiple physiological sensors are often required to map distinct signals from multiple points over large areas for more diverse applications. In this paper, we present a reusable, multichannel, surface electromyography (EMG) sensor array that covers multiple muscles over relatively large areas, with compliant designs that provide different levels of stiffness for repetitive uses, without backing layers. Mechanical and electrical characteristics along with distinct measurements from different muscles demonstrate the feasibility of the concept. The results should be useful to actively control devices in the environment with one array of wearable sensors, as demonstrated with home electronics.

Recent advances in soft materials and mechanics activate development of many new types of electrical medical implants. Electronic implants that provide exceptional functions, however, usually require more electrical power, resulting in shorter period of usages although many approaches have been suggested to harvest electrical power in human bodies by resolving the issues related to power density, biocompatibility, tissue damage, and others. Here, we report an active photonic power transfer approach at the level of a full system to secure sustainable electrical power in human bodies. The active photonic power transfer system consists of a pair of the skin-attachable photon source patch and the photovoltaic device array integrated in a flexible medical implant. The skin-attachable patch actively emits photons that can penetrate through live tissues to be captured by the photovoltaic devices in a medical implant. The wireless power transfer system is very simple, e.g., active power transfer in direct current (DC) to DC without extra circuits, and can be used for implantable medical electronics regardless of weather, covering by clothes, in indoor or outdoor at day and night. We demonstrate feasibility of the approach by presenting thermal and mechanical compatibility with soft live tissues while generating enough electrical power in live bodies through in vivo animal experiments. We expect that the results enable long-term use of currently available implants in addition to accelerating emerging types of electrical implants that require higher power to provide diverse convenient diagnostic and therapeutic functions in human bodies.

Monitoring cardiovascular signals such as heart rate and blood flow provides critically important healthcare information about patients under medical care. However, when the sensors are worn for extended times, the sensors sometimes require higher mechanical compatibility with soft deformable tissues. In this paper, we report an attachable and flexible pulse sensor (bending radius: 2.4 mm), integrated with micro-inorganic photodetectors (thickness: 4.1 μm, photocurrent: 8.99 μA under 1.5 mW/cm) and a red light emitting diode (620 nm), to monitor vital signals for extended times. Operating in a reflection mode, it can be attached and measure heart pulse waveforms from various locations on the human body including the finger, fingertip, nail, and forearm. The small form factor also enables integration on a finger ring. Electrical and mechanical performance assessments demonstrated the practical feasibility of the concept.

High-performance electronic devices integrated onto unconventional substrates provide opportunities for use in diverse applications, such as wearable or implantable forms of electronic devices. However, the interlayer adhesives between the electronic devices and substrates often limit processing temperature or cause electrical or thermal resistance at the interface. This paper introduces a very simple but effective transfer printing method that does not require an interlayer adhesive. Controlling the bending radius of a simple flat stamp enables picking up or printing of microscale semiconductor materials onto rigid, curvilinear, or flexible surfaces without the aid of a liquid adhesive. Theoretical and experimental studies reveal the underlying mechanism of the suggested approach. Adhesiveless printing of thin Si plates onto diverse substrates demonstrates the capability of this method.