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This article presents a novel band‐pass filter topology, based on the half‐mode substrate integrated waveguide (HMSIW), which allows for the simple design and easy manufacturing of filters with different bandwidth and number of poles. The design strategy, based on the modification of HMSIW cavity modes, is discussed in the case of two‐pole and four‐pole filters, and two prototypes are implemented and experimentally verified. © 2015 Wiley Periodicals, Inc. Int J RF and Microwave CAE 26:72–79, 2016.

The hybrid integration of an additively fabricated air-filled waveguide (WG) with a printed circuit board (PCB) is presented. An arrangement is proposed where different waveguiding structures share the same common metal plane on PCB. Such an approach allows combining the low-loss and high-Q properties of an air-filled waveguide, active circuit realization of the strip transmission line, and 3-D capabilities of additive manufacturing. A broadband transition is developed employing a through-patch coupling interface from a microstrip (MS) line to a waveguide. The concept was experimentally validated with exemplary transitions operating within X-band and K -band, featuring a measured bandwidth of f h / f l ≈ 1.4 and average pertransition loss including connecting lines of ∼1.2 and ∼1.9 dB, respectively.

In this letter, a novel wideband microstrip to additively fabricated waveguide transition is presented. The proposed design takes advantage of the flexibility of 3-D printing to realize a highly integrated transition from the microstrip line on a printed circuit board (PCB) to an air-filled waveguide using an additively manufactured radiating probe. The idea is experimentally verified by the realization of an exemplary transition working within the X-band at f 0 = 10.5 GHz. The measured performance of the back-to-back transition proves its usefulness and possibility of utilization in highly integrated PCB-waveguide circuits. A PolyJet printing technology with copper electroplating was used in combination with PCB on microwave grade laminate. A bandwidth of f H / f L = 1.8 was obtained with the impedance match better than 9.5 dB and in-band insertion loss per transition below 1.1 dB.