In order to address the challenge of increasing data rates, next generation optical communication networks will require the co-integration of electronics and photonics. Heterogeneous integration of these technologies has shown promise, but will eventually become bandwidth limited. Faster monolithic approaches will, therefore, be needed, but monolithic approaches using complementary metal-oxide-semiconductor (CMOS) electronics and silicon photonics are typically limited by their underlying electronic or photonic technologies. Here, we report a monolithically integrated electro-optical transmitter that can achieve symbol rates beyond 100 GBd. Our approach combines advanced bipolar CMOS with silicon plasmonics, and addresses key challenges in monolithic integration through the co-design of the electronic and plasmonic layers, including thermal design, packaging, and a nonlinear organic electro-optic material. To illustrate the potential of our technology, we develop two modulator conceptsan ultra-compact plasmonic modulator and, alternatively, a silicon-plasmonic modulator with photonic routing -both directly processed onto the bipolar CMOS electronics.
With metal stripes being intrinsic components of plasmonic waveguides, plasmonics provides a “naturally” energy-efficient platform for merging broadband optical links with intelligent electronic processing, instigating a great promise for low-power and small-footprint active functional circuitry. The first active Dielectric-Loaded Surface Plasmon Polariton (DLSPP) thermo-optic (TO) switches with successful performance in single-channel 10 Gb/s data traffic environments have led the inroad towards bringing low-power active plasmonics in practical traffic applications. In this article, we introduce active plasmonics into Wavelength Division Multiplexed (WDM) switching applications, using the smallest TO DLSPP-based Mach-Zehnder interferometric switch reported so far and showing its successful performance in 4×10 Gb/s low-power and fast switching operation. The demonstration of the WDM-enabling characteristics of active plasmonic circuits with an ultra-low power × response time product represents a crucial milestone in the development of active plasmonics towards real telecom and datacom applications, where low-energy and fast TO operation with small-size circuitry is targeted.
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