Multicore fiber enables a parallel optic data link with a single optical fiber, thus providing an attractive way to increase the total throughput and the integration density of the interconnections. We study and present photonics integration technologies and optical coupling approaches for multicore transmitter and receiver subassemblies. Such optical engines are implemented and characterized using multimode 6-core fibers and multicore-optimized active devices: 850-nm VCSEL and PD arrays with circular layout and multi-channel driver and receiver ICs. They are developed for bit-rates of 25 Gbps/channel and beyond, i.e. >150 Gbps per fiber, and also optimized for ruggedized transceivers with extended operation temperature range, for harsh environment applications, including space.

Low-loss single-mode waveguides are fabricated for optical interconnection applications. Such waveguides operating at telecom wavelength window are attractive for communicating between micro-photonic integrated circuit chips, such as silicon photonics, on the carrier/package, and also for enhanced coupling of photonic devices to fibers for longer reach interconnects. Manufacturing of the waveguides is based on direct pattering of optical polymeric materials by UV nanoimprinting. The advantages of the technology include the applicability to stack multiple layers of waveguides, fabrication on various substrate materials, and simultaneous fabrication of optical coupling structures. The developed process enables high wafer-level yield with precision overlay alignment. The multilayer waveguides were implemented using the so-called inverted rib waveguide process, that is, the shape of the waveguide cores are imprinted on the undercladding layer as grooves and then the core material is deposited on the cladding layer filling the grooves and also forming a thin slab layer. The subsequent deposition of the upper cladding layer finalizes the first waveguide layer and also starts the manufacturing of the next waveguide layer. The achieved wafer-scale layer-to-layer alignment tolerances were 1...2 µm and <0.3 µm in horizontal and vertical directions, respectively. Losses measured from the long waveguide spirals made of commercial ORMOCER materials on silicon wafers were 0.35 dB/cm at 1305 nm and 0.86 dB/cm at 1530 nm, which are only around 0.15 dB/cm higher than the material losses.

Polymer-based integrated optics is attractive for inter-chip optical interconnection applications, for instance, for coupling photonic devices to fibers in high density packaging. In such a hybrid integration scheme, a key challenge is to achieve efficient optical coupling between the photonic chips and waveguides. With the single-mode polymer waveguides, the alignment tolerances become especially critical as compared to the typical accuracies of the patterning processes. We study novel techniques for such coupling requirements. In this paper, we present a waveguide-embedded micro-mirror structure, which can be aligned with high precision, even active alignment method is possible. The structure enables 90 degree bend coupling between a single-mode waveguide and a vertical-emitting/detecting chip, such as, a VCSEL or photodiode, which is embedded under the waveguide layer. Both the mirror structure and low-loss polymer waveguides are fabricated in a process based mainly on the direct-pattern UV nanoimprinting technology and on the use of UVcurable polymeric materials. Fabrication results of the coupling structure with waveguides are presented, and the critical alignment tolerances and manufacturability issues are discussed.

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