No abstract

Tomato harvesting robot consists of visual sensor to detect matured fruit, end-effector to harvest with no damage, manipulator with 7 degrees of freedom and travelling device. The robot has to know the color and position of objects by the visual sensor. Besides, it must detect position of obstacles such as leaves and stems. Therefore, we developed a visual sensor which can input 3 dimensional image including distance information. The sensor emitted red and infrared laser beams from diodes by using mirror scanning to discriminate the color of object. The reflected beam was received

CMP is now the planarization method of choice in semiconductor manufacturing. However, CMP is still an immature process. Problems still exist with the uniformity and the stability of the CMP rate. These process variations stem from an incomplete understanding of the mechanism of CMP and the variation of CMP consumables like slurry, pad and backing film. To compensate for these variations, send-ahead processing and too many measurements are usually required. Obviously, these affect CMP productivity. For better CMP productivity and accurate film thickness control, in-process monitoring is a promising solution. In this paper, a CMP tool with built-in thickness measurement is presented. Such a builtin CMP ifim thickness monitor must satisfy several requirements: 1) the measurements need to be made at specified chips in the wafer and at specified sites in the chip, 2) the measurements should be accurate, 3) multiple film stack measurements must be possible and 4) high-speed measurements must be possible. These four issues of the built-in film thickness monitor are discussed.

No abstract

No abstract