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This paper presents experimental investigations of the flow-field characteristics downstream a Scaled-Up Micro-Tangential-Jet (SUMTJ) film-cooling scheme using the particle image velocimetry (PIV) technique over a flat plate. The SUMTJ scheme is a shaped scheme designed so that the secondary jet is supplied tangentially to the surface. The scheme combines the thermal benefits of tangential injection and the enhanced material strength of discrete holes’ schemes compared with continuous slot schemes. The flow-field characteristics downstream one row of holes were investigated at three blowing ratios, 0.5, 1.0, and 1.5, and were calculated based on the scheme exit area. A density ratio of unity, a Reynolds number of 1.16 × 105, and an average turbulence intensity of 8% were used throughout the investigations. The performance of the SUMTJ scheme was compared to that of the circular hole scheme, base line case case, at the same test conditions and blowing ratios. From the investigations, it was noticeable that the SUMTJ scheme jet stays attached to the surface for long downstream distances at all investigated blowing ratios. Moreover, the lateral expansion angles of the scheme help perform a continuous film from adjacent jets close to the schemes’ exits; however, they have a negative impact on the uniformity of the film thickness in the lateral direction. The vorticity strength downstream the SUMTJ scheme in the y-z plane was much less than the vorticity strength downstream the circular scheme at all blowing ratios. However, the vorticity behavior in the shear layer between the secondary SUMTJ scheme jet and the main stream was changing dramatically with the blowing ratio. The latter is expected to have a significant impact on the film-cooling performance as the blowing ratio increases.

With the advance of miniaturization technology, more and more electronic components are placed onto small electronic chips. This leads to the generation of high amounts of thermal energy that should be removed for the safe operation of these electronic components. Microchannel heat sinks, where electronic chips are liquid cooled instead of the conventional air cooling techniques, were proposed as a means to improve cooling rates. Later on, double layer micro channel heat sinks were suggested as an upgrade to single layer microchannel heat sinks with a better thermal performance. In the present study the effects of increasing the number of layers of the microchannel heat sink to three-layers as well as the effect of changing the flow arrangements (counter and parallel flows) within the three channel layers on the thermal performance of the heat sink were investigated. In all investigated cases the temperature distribution over the base of the microchannel heat sink system and the total pressure drop are reported. A range of mass flow rates from 1×10−4 to 5×10−4 kg/s was considered. Uniform heat flux conditions were considered during the study. COMSOL Multiphysics finite element package was employed for the numerical analysis. Results indicate significant enhancement in the uniformity of the temperature on the processor surface when multi-layer channels were employed, compared to the single-layer case. The uniformity in the temperature distribution was accompanied by reduction of pressure drop across channels for the same mass flow rate and heat flux conditions. The counter flow arrangement showed the best temperature distribution with the uniform heat flux cases.

The optimization aims to maximize the film cooling performance while minimizing the corresponding aerodynamic penalty. The film cooling performance is assessed using the adiabatic film cooling effectiveness, while the aerodynamic penalty is measured with a mass-averaged total pressure loss coefficient. Two design variables are selected; the coolant to mainstream temperature ratio and total pressure ratio. Two staggered rows of discrete cylindrical film cooling holes on the suction surface of a turbine vane are considered. The effect of varying the coolant flow parameters on the adiabatic film cooling effectiveness and the aerodynamic loss is analyzed using the optimization method and three-dimensional Reynolds-averaged Navier-Stokes (RANS) simulations. The CFD predictions of the adiabatic film cooling effectiveness and aerodynamic performance are assessed and validated against corresponding experimental measurements. The optimal solutions are reproduced in the experimental facility and the Pareto front is substantiated with experimental data. A non-dominated sorting genetic algorithm (NSGA-II) is coupled with an artificial neural network (ANN) to perform a multiple objective optimization of the film coolant flow parameters on the suction surface of a high pressure gas turbine vane. The numerical predictions are employed to construct the artificial neural network that produces low-fidelity predictions of the objectives during the optimization. The Pareto front of optimal solutions is generated by the optimization methodology.