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Abstract

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Traditional software-based diagnosis of failing chips typically identifies several lines where the failure is believed to reside. However, these lines can span across multiple layers and can be very long in length. This makes physical failure analysis difficult. In contrast, there are emerging diagnosis techniques that identify both the faulty lines as well as the neighboring conditions for which an affected line becomes faulty. In this paper, an approach is presented to improve failure localization by automatically analyzing the information associated with the outcome of diagnosis. Experimental results show a significant improvement in failure localization when this method is applied to 106 real IC failures.