In this work, we utilized the regular polyhydroxylic complexing agents' saccharose and xylitol to develop an eco-friendly electroless deposition process for copper. The electroless bath used formaldehyde free glyoxylic acid as reducing agent and KOH as the pH adjustor, rather than NaOH, to avoid the development of insoluble by-product. A small volume of the green Bronsted acid, methanesulphonic acid (MSA) was also used in the bath to improve solubility of the copper salts. The surface morphologies and structural property of copper deposits were characterized by SEM, AFM and XRD studies. Pyridine and 2,2-dipyridyl as primary stabilizers in saccharose and xylitol baths were found to influence the deposition rate and thickness of the copper deposits. In the saccharose bath, Pyridine performed as inhibitors and best deposition was obtained at pH of 12.75. 2,2-dipyridyl afforded smoother and shiner deposits than Pyridine. In xylitol bath, both the stabilizers were best deposition occurred at a pH of 13.25 and served as the accelerator and extended the life of the electroless bath.
The thermodynamic excess functions of a composition of chloroform and ketones were studied in this work. The ketones used as acetophenone, cyclophexanone and ethyl methyl ketone. Ultrasonic velocity for the liquid mixtures are measured over a wide range of concentrations, using a single crystal ultrasonic interferometer at a frequency of 2 MHz. For binary mixtures of chloroform with acetophenone and cyclohexanone, surface tension increases with increase in concentration of the ketone. But for the binary mixtures of chloroform and ethyl methyl ketone surface tension decreases with increase in concentration of the ketone.
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