We have developed a novel, low cost, scanning Kelvin probe (SKP) system that can measure work function (wf) and surface potential (sp) topographies to within 1 meV energy resolution. The control and measurement subcomponents are PC based and incorporate a flexible user interface, permitting software control of major parameters and allowing easy user implementation via automatic setup and scanning procedures. We review the mode of operation and design features of the SKP including the digital oscillator, the compact ambient voice-coil head-stage, and signal processing techniques. This system offers unique tip-to-sample spacing control (to within 40 nm) which provides a method of simultaneously imaging sample height topographies and is essential to avoid spurious or “apparent” wf changes due to scanning-induced spacing changes. We illustrate SKP operation in generating high resolution wf/sp profiles of metal interfaces (as a tip characterization procedure) and operational electronic devices. The SKP potentially has a very wide range of applications ranging from semiconductor quality control thin film and surface analyses to corrosion and biopotential imaging.
The Kelvin probe, used to measure changes in work function (wf), has proved particularly useful as a UHV surface analysis technique, having applications in the study of thin films, adsorption kinetics, surface photovoltage spectroscopy, surface topographies, etc. However the Kelvin circuit is plagued by noise problems, which are considerably enhanced by long connecting wires and the nonideal UHV environment. Careful shielding is essential in order to improve the signal-to-noise (S/N) ratio, especially at backing potentials close to the null condition. Although lock-in-amplifier (LIA) based automatic compensation systems are available they operate on low signal levels and are prone to electromagnetic pickup from the driving element and mechanical instabilities of the vibrating capacitor. We discuss the general noise spectrum and describe an alternative ‘‘off-null’’ approach utilizing a data-acquisition-system (DAS) based measuring system that features an active suspension system (ASS), automatic set-up, and software elimination of driver talkover. This system has applications where very high resolution (<0.1 meV) is required, or if low S/N ratios caused by reduced probe dimensions or a high noise background would otherwise prejudice the measurement.
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