The wake-up behavior of ferroelectric thin film capacitors based on doped hafnium oxide dielectrics in TiN-based metal-insulator-metal structures is reported. After field cycling a remanent polarization up to 40 C/cm 2 and a high coercive field of about 1MV/cm was observed. Doping of HfO2 by different dopants with a crystal radius ranging from 54pm (Si) to 132pm (Sr) was evaluated. In all cases, an improved polarization-voltage hysteresis after wake-up cycling is visible. For smaller dopant atoms like Si and Al stronger pinching of the polarization hysteresis appeared with increasing dopant concentration and proved to be stable during cycling. ©2014 The Japan Society of Applied Physics

We report the observation of ferroelectric characteristics in undoped hafnium oxide thin films in a thickness range of 4–20 nm. The undoped films were fabricated using atomic layer deposition (ALD) and embedded into titanium nitride based metal-insulator-metal (MIM) capacitors for electrical evaluation. Structural as well as electrical evidence for the appearance of a ferroelectric phase in pure hafnium oxide was collected with respect to film thickness and thermal budget applied during titanium nitride electrode formation. Using grazing incidence X-Ray diffraction (GIXRD) analysis, we observed an enhanced suppression of the monoclinic phase fraction in favor of an orthorhombic, potentially, ferroelectric phase with decreasing thickness/grain size and for a titanium nitride electrode formation below crystallization temperature. The electrical presence of ferroelectricity was confirmed using polarization measurements. A remanent polarization Pr of up to 10 μC cm−2 as well as a read/write endurance of 1.6 × 105 cycles was measured for the pure oxide. The experimental results reported here strongly support the intrinsic nature of the ferroelectric phase in hafnium oxide and expand its applicability beyond the doped systems

The recent discovery of ferroelectricity in thin hafnium oxide films has led to a resurgence of interest in ferroelectric memory devices. Although both experimental and theoretical studies on this new ferroelectric system have been undertaken, much remains to be unveiled regarding its domain landscape and switching kinetics. Here we demonstrate that the switching of single domains can be directly observed in ultrascaled ferroelectric field effect transistors. Using models of ferroelectric domain nucleation we explain the time, field and temperature dependence of polarization reversal. A simple stochastic model is proposed as well, relating nucleation processes to the observed statistical switching behavior. Our results suggest novel opportunities for hafnium oxide based ferroelectrics in nonvolatile memory devices.

Bound to complex perovskite systems, ferroelectric random access memory (FRAM) suffers from limited CMOS-compatibility and faces severe scaling issues in today's and future technology nodes. Nevertheless, compared to its current-driven non-volatile memory contenders, the field-driven FRAM excels in terms of low voltage operation and power consumption and therewith has managed to claim embedded as well as stand-alone niche markets. However, in order to overcome this restricted field of application, a material innovation is needed. With the ability to engineer ferroelectricity in HfO 2 , a high-k dielectric well established in memory and logic devices, a new material choice for improved manufacturability and scalability of future 1T and 1T-1C ferroelectric memories has emerged. This paper reviews the recent progress in this emerging field and critically assesses its current and future potential. Suitable memory concepts as well as new applications will be proposed accordingly. Moreover, an empirical description of the ferroelectric stabilization in HfO 2 will be given, from which additional dopants as well as alternative stabilization mechanism for this phenomenon can be derived. The recent success of smartphones and tablet computers has accelerated the R&D of fast and energy efficient non-volatile semiconductor memories, capable of replacing the conventional SRAM-DRAM-Flash memory hierarchy. These so called emerging memories usually leverage on the fact that certain materials possess the capacity for remembering their electric, magnetic or caloric history. For the extensively investigated ferroelectrics this ability to memorize manifests in atomic dipoles switchable in an external electric field. This unique property renders them the perfect electric switch for semiconductor memories. Consequently, only a few years after the realization of a working transistor the first ferroelectric memory concepts were proposed. 1 However, more than 60 years and several iterations later it is now clear that the success or failure of FRAM is mainly determined by the proper choice and engineering of the ferroelectric material. Perovskite ferroelectrics and related electrode systems underwent an extensive optimization process to meet the requirements of CMOS integration and are now considered the front up solution in FRAM manufacturing. Nevertheless, those perovskite systems require complex integration schemes and pose scaling limitations on 1T and 1T-1C memory cells that until now remain unsolved. This creates an unbalance between memory performance on the one side and manufacturing and R&D costs on the other side. This dilemma has ever since restricted FRAM to niche markets.With the recent demonstration of ferroelectricity in HfO 2 -based systems (FE-HfO 2 ) a CMOS-compatible, highly scalable and manufacturable contender has emerged, that significantly expands the material choice for 1T and 1T-1C ferroelectric memory solutions (Reference 2 and references therein) as well as nanoscale ferroelectric devices.In this paper we will r...

With the ability to engineer ferroelectricity in HfO2 thin films, manufacturable and highly scaled MFM capacitors and MFIS-FETs can be implemented into a CMOS-environment. NVM properties of the resulting devices are discussed and contrasted to existing perovskite based FRAM