This paper presents a new methodology to extract, at a given operation condition, the statistical distribution of the number of active defects that contribute to the observed device Time-Dependent Variability, as well as their amplitude distribution. Unlike traditional approaches based on complex and time-consuming individual analysis of thousands of current traces, the proposed approach uses a simpler trace processing, since only the maximum and minimum values of the drain current during a given time interval are needed. Moreover, this extraction method can also estimate defects causing small current shifts, which can be very complex to identify by traditional means. Experimental data in a wide range of gate voltages, from near-threshold up to nominal operation conditions, are analyzed with the proposed methodology.
This paper presents an innovative and automated measurement setup for the characterization of variability effects in CMOS transistors using array-based integrated circuits, through which a better understanding of CMOS reliability could be attained. This setup addresses the issues that come with the need for a trustworthy statistical characterization of these effects: testing a very large number of devices accurately but, also, in a timely manner. The setup consists of software and hardware components that provide a user-friendly interface to perform the statistical characterization of CMOS transistors. Five different electrical tests, comprehending time-zero and time-dependent variability effects, can be carried out. Test preparation is, with the described setup, reduced to a few seconds. Moreover, smart parallelization techniques allow reducing the typically timeconsuming aging characterization from months to days or even hours. The scope of this paper thus encompasses the methodology and practice of measurement of CMOS time-dependent variability, as well as the development of appropriate measurement systems and components used in efficiently generating and acquiring the necessary electrical signals.
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