High-efficiency InGaN-based light-emitting diodes have been grown on (111) silicon substrates and investigated with regard to efficiency and carrier lifetime as a function of current density. Using a single quantum well active layer ensures a well-defined active volume which enables the precise determination of the recombination coefficients in the ABC rate model for different emission wavelengths and junction temperatures. Good agreement of the resulting C values with calculated Auger coefficients is found both with respect to absolute value as well as their dependence on bandgap energy and temperature

Combining aberration corrected high resolution transmission electron microscopy and density functional theory calculations we propose an explanation of the antisurfactant effect of Si in GaN growth. We identify the atomic structure of a Si delta-doped layer (commonly called SiN(x) mask) as a SiGaN(3) monolayer that resembles a √3×√3 R30° surface reconstruction containing one Si atom, one Ga atom, and a Ga vacancy (V(Ga)) in its unit cell. Our density functional theory calculations show that GaN growth on top of this SiGaN(3) layer is inhibited by forming an energetically unfavorable electrical dipole moment that increases with layer thickness and that is caused by charge transfer between cation dangling bonds at the surface to V(Ga) bound at subsurface sites.

Recent progress in the epitaxy of InGaN LEDs leads to a significant improvement of output power for green LEDs: 100 lm at 350 mA and 189 lm at 1 A are demonstrated for a 1 mm2 ThinGaN Chip at 531 nm, mounted in an OSRAM Dragon package with spherical silicone lens and OSRAM Argus lens. The chip is especially designed for low current applications like LCD backlighting where high efficiencies are needed. Efficacies of 123 lm/W at 100 mA and 80 lm/W at 350 mA have been achieved with this LED. The Influence of Multi Quantum Well emission on LED brightness was investigated in respect of driving current and temperature. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

The internal quantum efficiency of (AlxGa1−x)0.5In0.5P light-emitting devices (LEDs), with an emission wavelength ranging from 650 to 560 nm, is determined by means of a model that takes into account the radiative and nonradiative recombination in the active layer, the diffusive leakage of carriers into the confining layers, and the influence of photon recycling on the light extraction efficiency. The evaluation is based on measurements of the external quantum efficiency of the LEDs as a function of the operating current and temperature. The analysis provides the wavelength dependence of both the nonradiative recombination as well as the carrier leakage.

Thin AlGaN interlayers have been grown into a thick GaN stack on Si substrates to compensate tensile thermal stress and significantly improve the structural perfection of the GaN. In particular, thicker interlayers reduce the density in a-type dislocations as concluded from x-ray diffraction (XRD) measurements. Beyond an interlayer thickness of 28 nm plastic substrate deformation occurs. For a thick GaN stack, the first two interlayers serve as strain engineering layers to obtain a crack-free GaN structure, while a third strongly reduces the XRD ω-(0002)-FWHM. The vertical strain and quality profile determined by several XRD methods demonstrates the individual impact of each interlayer.