Unipolar resistive switching behaviors of Ru∕HfOx∕TiN devices with Ru as anode were investigated. Wide dispersion of switching operation parameters was observed. The conduction mechanisms in low and high resistance states of the devices were characterized to be Ohmic-like and tunneling, respectively. The band offset of the Ru∕HfOx interface was extracted from the measured tunneling current versus voltage characteristics. Instability of the band offset at the anodic interface was observed and may be responsible for the wide fluctuation of the operation voltage in the Ru∕HfOx∕TiN device at a high resistance state. The possible mechanism for these unstable characteristics of band offset at the Ru∕HfOx interface is also discussed.
The concept of ferroelectric (FE) negative capacitance (NC) may be a turning point in overcoming the physical limitations imposed by the Boltzmann tyranny to realize next-generation state-of-the-art devices. Both the body factor (m-factor) and the transport mechanism (n-factor) are simultaneously improved by integrating an NC with a tunnel FET (TFET). The modeling approach is discussed in this study as well as the NC physics. By optimizing the thicknesses of FE, semiconductor, and interfacial layers, the capacitance of the FE layers is modulated to match that of a MOS resulting in the smallest subthreshold swing that is also hysteresis-free. An ultrathin-body double gate tunnel FET (UTB-DG-TFET) exhibits a steep slope (a subthreshold swing below 10 mV/dec over more than 4 orders of magnitude) for low-power applications (<0.2 V switching voltage) to realize next-generation state-of-the-art devices.
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