Efficient cooling of silicon chips using microfin structures made of aligned multiwalled carbon nanotube arrays is achieved. The tiny cooling elements mounted on the back side of the chips enable power dissipation from the heated chips on the level of modern electronics demands. The nanotube fins are mechanically superior compared to other materials being ten times lighter, flexible, and stiff at the same time. These properties accompanied with the relative simplicity of the fabrication makes the nanotube structures strong candidates for future on-chip thermal management applications.

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Piezoelectric thin-film sensors are suitable for a wide range of applications from physiological measurements to industrial monitoring systems. The use of flexible materials in combination with high-throughput printing technologies enables cost-effective manufacturing of custom-designed, highly integratable piezoelectric sensors. This type of sensor can, for instance, improve industrial process control or enable the embedding of ubiquitous sensors in our living environment to improve quality of life. Here, we discuss the benefits, challenges and potential applications of piezoelectric thin-film sensors. The piezoelectric sensor elements are fabricated by printing electrodes on both sides of unmetallized poly(vinylidene fluoride) film. We show that materials which are solution processable in low temperatures, biocompatible and environmental friendly are suitable for use as electrode materials in piezoelectric sensors.

We report the fabrication and characterization of supercapacitors prepared on a flexible substrate using a printable, high-viscosity carbon nanotube (CNT) ink. The CNT-hemicellulose composite ink was prepared using ultrasonication and applied on the substrate with a doctor blade. Aqueous sodium chloride was used as electrolyte. The capacitance of the supercapacitors was 16 mF for a device size of 2 cm2. The measurements were carried out in accordance to an international standard for electric double layer capacitors.