Multilayer circuits, especially in stretchable electronic devices, are considered to be an effective way to integrate various components and modules for complex functions. However, the existing manufacturing methods for multilayer flexible and stretchable electronics have problems such as complex technology, expensive equipment, and low production efficiency. Here, a direct ink writing 3D printing method is proposed to fabricate multilayer stretchable electronic devices by using high‐viscosity stretchable silver paste as the material for interconnecting wires, and stretchable polydimethylsiloxane as the dielectric layer. The optimal range of printing parameters is explored to realize the stable and repeatable manufacturing of wires. A protective layer is printed on the interconnection wires and rigid components to connect the soft substrate and the rigid electronic components. The results show that stress concentration is reduced and stable electrical response of the device is achieved under more than 49% tensile deformation. Vertical interconnect accesses and arc‐shaped wires are applied to a multilayer flexible thermal imaging display device and a NE555 timer device, and the outcomes prove that the direct ink writing 3D printing method provides an efficient, simple, and low‐cost manufacturing method for fabricating multilayer stretchable electronics.

Multilayer flexible electronics have broad applications in the fields of sensors, biomedicine, flexible displays, etc. The existing multilayer flexible electronic manufacturing methods are complicated and usually require multiprocess and multiequipment combinations for processing; especially, it is difficult to achieve integrated manufacturing. The increase in the overall thickness of multilayer flexible electronics also limits its flexibility, stretchability, and spatial density. Herein, a method for integrated multinozzle 3D printing of multilayer flexible electronics with thin structures is proposed and a new strategy for interlayer interconnection is presented. Printing high‐viscosity stretchable silver paste on the edge of the multilayer dielectric material and avoiding microholes and vertically printed conductive micropillar structures in traditional interlayer interconnection wires are discussed. The influences of process parameters on the fabrication of multilayer and thin flexible electronics are explored, and the minimum layer thickness for the fabrication of multilayer circuits is determined. A five‐layer flexible pressure sensor and two flexible electromagnetic actuators with different coils are fabricated, and the related performance tests of the two devices are carried out. The test results demonstrate that the proposed fabrication method of flexible electronics provides a high‐efficiency, low‐cost, and simple manufacture solution for the fabrication of multilayer and thin flexible electronics.