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Carbon nanotube (CNT) field-effect transistors (FETs) and integrated circuits (ICs) have been predicted and demonstrated to be some of the most promising candidates for radiation-hardened electronics. The studies mainly focused on the radiation response of the whole transistors, and experiments or analyses to reveal the detailed radiation responses of different components of the FET were absent. Here, we use a controllable experimental method to decouple the total ionizing dose (TID) radiation effects on different individual components of top-gate CNT FETs, including the CNT channel, gate dielectric, and substrate. The substrate is found to be more vulnerable to radiation damage than the gate dielectric and CNT film in FETs. Furthermore, the CNT film not only acts as a radiation-hardened semiconducting channel but also protects the channel/substrate interface by partially shielding the substrate from radiation damage. On the basis of the experimental data, a model is built to predict the irradiation resistance limit of CNT top-gated FETs, which can withstand at least 155 kGy irradiation.

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