Hybrid photonic integration exploits complementary strengths of different material platforms, thereby offering superior performance and design flexibility in comparison to monolithic approaches. This applies in particular to multi-chip concepts, where components can be individually optimized and tested on separate dies before integration into more complex systems. The assembly of such systems, however, still represents a major challenge, requiring complex and expensive processes for high-precision alignment as well as careful adaptation of optical mode profiles. Here we show that these challenges can be overcome by in-situ nano-printing of freeform beam-shaping elements to facets of optical components. The approach is applicable to a wide variety of devices and assembly concepts and allows adaptation of vastly dissimilar mode profiles while considerably relaxing alignment tolerances to the extent that scalable, cost-effective passive assembly techniques can be used. We experimentally prove the viability of the concept by fabricating and testing a selection of beam-shaping elements at chip and fiber facets, achieving coupling efficiencies of up to 88 % between an InP laser and an optical fiber. We also demonstrate printed freeform mirrors for simultaneously adapting beam shape and propagation direction, and we explore multi-lens systems for beam expansion. The concept paves the way to automated fabrication of photonic multi-chip assemblies with unprecedented performance and versatility.

No abstract

Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. As a key advantage, the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips, thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision alignment. However, while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments, it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability requirements. In this paper, we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode fibres. In a first experiment, we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation. A second experiment is dedicated to a four-channel coherent transmitter, operating at a net data rate of 732.7 Gbit/sa record for coherent silicon photonic transmitters with co-packaged lasers. Using dedicated test chips, we further demonstrate automated mass production of photonic wire bonds with insertion losses of (0.7 ± 0.15) dB, and we show their resilience in environmental-stability tests and at high optical power. These results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

Miniaturized integrated optical coherence tomography (OCT) systems have the potential to unlock a wide range of both medical and industrial applications. This applies in particular to multi-channel OCT schemes, where scalability and low cost per channel are important, to endoscopic implementations with stringent size demands, and to mechanically robust units for industrial applications. We demonstrate that fully integrated OCT systems can be realized using the state-of-the-art silicon photonic device portfolio. We present two different implementations integrated on a silicon-on-insulator (SOI) photonic chip, one with an integrated reference path (OCTint) for imaging objects in distances of 5 mm to 10 mm from the chip edge, and another one with an external reference path (OCText) for use with conventional scan heads. Both OCT systems use integrated photodiodes and an external swept-frequency source. In our proof-of-concept experiments, we achieve a sensitivity of −64 dB (−53 dB for OCTint) and a dynamic range of 60 dB (53 dB for OCTint). The viability of the concept is demonstrated by imaging of biological and technical objects.

Glassy carbon is a graphenic form of elemental carbon obtained from pyrolysis of carbon-rich precursor polymers that can be patterned using various lithographic techniques. It is electrically and thermally conductive, mechanically strong, light, corrosion resistant and easy to functionalize. These properties render it very suitable for Carbon-microelectromechanical systems (Carbon-MEMS) and nanoelectromechanical systems (Carbon-NEMS) applications. Here we report on the fabrication and characterization of fully operational, microfabricated glassy carbon nano-tips for Atomic Force Microscopy (AFM). These tips are 3D-printed on to micro-machined silicon cantilevers by Two-Photon Polymerization (2PP) of acrylate-based photopolymers (commercially known as IP-series resists), followed by their carbonization employing controlled pyrolysis, which shrinks the patterned structure by ≥98% in volume. Tip performance and robustness during contact and dynamic AFM modes are validated by morphology and wear tests. The design and pyrolysis process optimization performed for this work indicate which parameters require special attention when IP-series polymers are used for the fabrication of Carbon-MEMS and NEMS. Microstructural characterization of the resulting material confirms that it features a frozen percolated network of graphene sheets accompanied by disordered carbon and voids, similar to typical glassy carbons. The presented facile fabrication method can be employed for obtaining a variety of 3D glassy carbon nanostructures starting from the stereolithographic designs provided by the user.