Hafnium oxide is an outstanding candidate for next-generation nonvolatile memory solutions such as OxRAM (oxide-based resistive memory) and FeRAM (ferroelectric random access memory). A key parameter for OxRAM is the controlled oxygen deficiency in HfO2‑x which eventually is associated with structural changes. Here, we expand the view on the recently identified (semi-)conducting low-temperature pseudocubic phase of reduced hafnium oxide by further X-ray diffraction analysis and density functional theory (DFT) simulation and reveal its rhombohedral nature. By performing total energy and electronic structure calculations, we investigate phase stability and band structure modifications in the presence of oxygen vacancies. With increasing oxygen vacancy concentration, the material transforms from the well-known monoclinic structure to a (pseudocubic) polar rhombohedral r-HfO2–x structure. The DFT analysis shows that r-HfO2–x is not merely epitaxy-induced but may exist as a relaxed compound. Furthermore, the electronic structure of r-HfO2–x as determined by X-ray photoelectron spectroscopy and UV/Vis spectroscopy corresponds very well with the DFT-based prediction of a conducting defect band. The existence of a substoichiometric (semi-)conducting phase of HfO2–x is obviously an important ingredient to understand the mechanism of resistive switching in hafnium-oxide-based OxRAM.

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Hafnium oxide- and GeSbTe-based functional layers are promising candidates in material systems for emerging memory technologies. They are also discussed as contenders for radiation-harsh environment applications. Testing the resilience against ion radiation is of high importance to identify materials that are feasible for future applications of emerging memory technologies like oxide-based, ferroelectric, and phase-change random-access memory. Induced changes of the crystalline and microscopic structure have to be considered as they are directly related to the memory states and failure mechanisms of the emerging memory technologies. Therefore, we present heavy ion irradiation-induced effects in emerging memories based on different memory materials, in particular, HfO 2 -, HfZrO 2 -, as well as GeSbTe-based thin films. This study reveals that the initial crystallinity, composition, and microstructure of the memory materials have a fundamental influence on their interaction with Au swift heavy ions. With this, we provide a test protocol for irradiation experiments of hafnium oxide- and GeSbTe-based emerging memories, combining structural investigations by X-ray diffraction on a macroscopic, scanning transmission electron microscopy on a microscopic scale, and electrical characterization of real devices. Such fundamental studies can be also of importance for future applications, considering the transition of digital to analog memories with a multitude of resistance states.