No abstract

International audienc

This paper reviews sampling techniques for inspection in semiconductor manufacturing. We discuss the strengths and weaknesses of techniques developed in the last last 20 years for excursion monitoring (when a process or machine falls out of specifications) and control. Sampling techniques are classified into three main groups: static, adaptive, and dynamic. For each group, a classification is performed per year, approach, and industrial deployment. A comparison between the groups indicates a complementarity strongly linked to the semiconductor environment. Benefits and drawbacks of each group are discussed, showing significant improvements from static to dynamic through adaptive sampling techniques. Dynamic sampling seems to be more appropriate for modern semiconductor plants.

No abstract

International audienceProduction planning in the Semiconductor Industry (SI) has emerged as the most complex process due to its process complexity, technological constraints and high-mix low-volume production characteristics. In this paper, we present two different production planning approaches, developed by STMicroelectronics and G-SCOP research laboratory, to better control the production in 300mm production line at Crolles. At first, a mixed integer program (MIP) is proposed that projects the production lot trajectories (start and end dates) for the remaining subsequent steps, taking into account finite production capacities. A heuristic is then proposed to simplify the problem of finite capacity by neglecting equipment capacity. This approach results in the development of an infinite capacity WIP projection engine that complies with lots due dates and takes into account cycle time variability