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This study considers non-contact methods that obviate the causes of measurement error, such as thermal contact resistance and the unnecessary destruction of samples. Among the methods, the photothermal deflection method has been adopted and developed to measure the thermal conductivities of thin-film materials. To apply the developed method for thin films, bi-layered materials are manufactured by depositing the film on Corning 7740 glass plates. The study also investigates the optimal modulation frequency, as related to the thermal diffusion length of the sample, for measuring thermal conductivities of thin films.. Aluminum, TiO 2 , and Si 3 N 4 films with micro/nanometer thickness were selected as the objects for measurement; the thermal conductivities of these films were experimentally measured. Samples of thickness ranging from 1 ㎛ to 200 ㎚ were prepared to measure the variations in thermal conductivities with thickness. It was observed that the thermal conductivity in submicroscale films decreased as the thickness was reduced.

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A method of measuring the thermal diffusivity of solid material at room temperature using photothermal displacement is proposed. The influence of the parameters, such as the radius and modulation frequency of the pump beam and the sample thickness, was studied. From the minimum position of phase of measured deflection with respect to the pump beam, the thermal diffusivity of the materials can be obtained. The position where phase has the minimum value is determined using multiparameter least-square regression fitting. The experimental values for different samples obtained by applying the method are in good agreement with the literature values.