Silver nanoparticles with average diameter of 22.4 nm were prepared by aqueous reduction method for low-temperature sintering bonding application. The reaction temperature and PVP concentration, which are the influential factors of nanoparticle characteristics, were investigated during reduction process. In our research, monodispersity of nanoparticles was remarkably improved while unfavorable agglomeration was avoided with the AgNO3/PVP mass ratio of 1 : 4 at the reaction temperature 30°C. Besides, copper pads were successfully bonded using sintering paste employing fresh silver nanoparticles with diameter of 20~35 nm at 200°C. In addition, after morphology of the bonding joint was analysed by scanning electron microscope (SEM), the porous sintering characteristics were confirmed.

The behavior of gold atoms depending on the CNT chirality in a nanojoining process is studied by molecular dynamics simulation. The deformation regularity and the diffusing characteristic of the gold particle during the joining process, as well as the C-Au bonds distribution in the final joint are studied. Our results show that when joining with higher spirality CNT, gold particle tends to deform more. With the CNT more similar to armchair type, the gold particle as a whole displaces more. In the final joint, the total bonds number decreases from typical armchair CNT to typical zig-zag CNT. However, the bonds distribution in detail is irregular from joint to joint, which is the consequence of lattice structure of both materials.