Knowledge of the loads to which orthopedic implants are subjected is a fundamental prerequisite for their optimal biomechanical design, long-term success, and improved rehabilitation outcomes. In vivo load measurements are more accurate than those obtained using mathematical musculoskeletal models. An inductively powered integrated circuit inside the implant measures six load components as well as the temperature and supplied voltage. This low-power circuit includes a 9-channel multiplexer, a programmable memory, a pulse interval modulator, and a radio-frequency transmitter. Together with a few passive components, the integrated circuit is mounted on a ceramic substrate with thick-film hybrid technology. The sensor signals are multiplexed, modulated, and transmitted to an external device. The microcontroller of the external device regulates the alternating magnetic field produced by a power oscillator and synchronizes the pulse interval modulated data stream. A personal computer displays forces, moments, and temperatures in real time. The new telemetry transmitter has, thus far, been used for in vivo load measurements in three patients with shoulder endoprostheses. Eight instrumented vertebral body replacements are ready for implantation, and an instrumented tibial tray is being submitted to laboratory tests.

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