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I wish to thank my supervisors Professor Yngvar Berg and Associate Professor Dag T. Wisland for their guidance and encouragement while working on the project. Professor Berg was the one who introduced me to the interesting fields of floating-gate circuits and multiple-valued logic. Both supervisors have given invaluable help in practical as well as in academic terms. Above all though, you have believed in my project and my ability to complete it. My fellow PhD-students Johannes G. Lomsdalen, Henning Gundersen and Omid Mirmotahari have willingly shared their experiences. Our many long conversations have been valuable and inspiring. I would like to thank all of you for the time we have worked together as colleagues, first at MSc level and later at PhD. It has been a good period of my life both academically and socially. I would also like to thank the rest of my colleagues in the Department of Informatics who have contributed. In particular Snorre Aunet, Øivind Naess and Mads Høvin. Finally, I would like to thank everyone else who has helped make this thesis a reality.

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The SOFR model is modified for SOCs in consumer electronics applications such as game consoles for advanced logic technology nodes (~2X nm). Using a representative voltage/temperature dataset from XBOX ONE SOC operation, a quantitative measure of "degree of over-design coefficient ( )" is developed to better understand the impact of worst case reliability assumptions on thermal design. A simple analytical model is also developed to illustrate the relationship between silicon level failure rates and a system level thermal design parameter ( ), or the heat transfer coefficient. The heat transfer coefficient ( is also identified as a proxy for thermal design elements such as heat sink size, fan size and speed, which strongly influence user experience. It is thus emphasized that use of SOFR model minimizes thermal over-design, thereby improving user experience, without compromising reliability