dielectrics for future stackedcapacitor DRAM Thin films of barium-strontium titanate (Ba,Sr)TiO 3 (BSTO) have been investigated for use as a capacitor dielectric for future generations of dynamic random-access memory (DRAM). This paper describes progress made in the preparation of BSTO films by liquid-source metal-organic chemical vapor deposition (LS-MOCVD) and the issues related to integrating films of BSTO into a DRAM capacitor. Films of BSTO deposited on planar Pt electrodes meet the electrical requirements needed for future DRAM. The specific capacitance and charge loss are found to be strongly dependent on the details of the BSTO deposition, the choice of the lower electrode structure, the microstructure of the BSTO, the post-electrode thermal treatments, BSTO dopants, and thin-film stress. Films of BSTO deposited on patterned Pt electrodes with a feature size of 0.2 m are found to have degraded properties compared to films on large planar structures, but functional bits have been achieved on a DRAM test site at 0.20-m ground rules. Mechanisms influencing specific capacitance and charge loss of BSTO films are described, as are the requirements for the electrode and barrier materials used in stacked-capacitor structures, with emphasis given to the properties of the Pt/TaSi(N) electrode/barrier system. Major problems requiring additional investigation are outlined.

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Cash Flow System Development Framework within Integrated Project Delivery (IPD) using BIM tools Integrated Project Delivery (IPD) endeavour to revamp AEC project outcomes through a collaborative method of regulating project stakeholders' goals through creation of a platform that provide early participants involvement and shared risk and rewards. IPD does not include a tender stage to select the optimal bid, therefore, this paper presents a methodology framework to develop a cash flow approach using BIM tools. This paper adopts Activity Based Costing (ABC), due to its ability to allocate different costs precisely to each construction process. Given that the BIM and IPD target is to achieve the best collaboration among project parties, the proposed framework backing this by displaying all estimated cost data of each package as minimum/maximum estimated cash inflow, during the buyout stage, for informed decision making. This paper extends the knowledge relating to IPD implementing process, as well as, improving cost management process based on BIM. Extant literature review highlights the gap of utilising BIM tools to develop cash flow curves, as well as the IPD cost structure requirements. To demonstrate the applicability and validity of the proposed model, it is applied to a real-life case study, which displays promising results in terms of developing IPD's cash flow management approach.

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We have developed a reactive ion etch (RIE) process in borophosphosilicate glass (BPSG) for 150 nm line-and-space features, where line-edge roughness (LER) complemented with RIE lag becomes a major issue. Effect of flow rates and carbon-to-fluorine atomic ratio of fluorohydrocarbon gases was utilized to achieve acceptable process window allowing lower radio frequency powers therefore obtaining acceptable LER and RIE lag in the high-resolution features etched into BPSG.