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In planar Flash memories the most popular memory cell is based on the Floating Gate (FG) technology, whose cross section is shown in Fig. 3.1. Cross section and the associated floating gate model are sketched in Fig. 3.2. Basically, a MOS transistor is built with two overlapping gates: the first one (FG) is completely surrounded by oxide, while the second one forms the Control Gate (CG) terminal. The isolated gate constitutes an excellent "trap" for electrons, enabling long charge retention. The operations used to inject and remove electrons from the isolated gate are called Program and Erase, respectively. These operations modify the threshold voltage V TH of the memory cell, which is, at the end of the day, a MOS transistor. By applying a fixed voltage to the cell's terminals, it is then possible to discriminate two storage levels: when the gate voltage is higher than V TH , the cell is ON ("1"), vice versa it is OFF ("0").To minimize the space on silicon, memory cells are packed together to form a matrix. Depending on how the cells are organized inside the matrix, it is possible to distinguish between NAND and NOR Flash memories. NAND memories are the most widespread in the storage systems; NOR architecture is described in great details in [1].In the NAND string, memory cells are connected in series, in groups of 32, 64, 128, or even 150 [2], as shown in Fig. 3.3. Two select transistors are placed at the edges of the string, to ensure the connection to the source line (through M SL ) and to
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