The application of compressive sensing (CS) for imaging has been extensively investigated and the underlying mathematical principles are well understood. The theory of CS is motivated by the sparse nature of real-world signals and images, and provides a framework in which high-resolution information can be recovered from low-resolution measurements. This, in turn, enables hardware concepts that require much fewer detectors than a conventional sensor. For infrared imagers there is a significant potential impact on the cost and footprint of the sensor. When smaller focal plane arrays (FPAs) to obtain large images are allowed, large formats FPAs are unnecessary. From a hardware standpoint, this benefit is independent of the actual level of compression and effective data rate reduction, which depend on the choice of codes and information recovery algorithm. Toward this end, we used a CS testbed for mid-wave infrared (MWIR) to experimentally show that information at high spatial resolution can be successfully recovered from measurements made with a small FPA. We describe the highly parallel and scalable CS architecture of the testbed, and its implementation using a reflective spatial light modulator and a focal plane array with variable pixel sizes. We also discuss the impact of real-world devices and the effect of sensor calibration that must be addressed in practice. Finally, we present preliminary results of image reconstruction, which demonstrate the testbed operation. These results experimentally confirm that high-resolution spatial information (for tasks such as imaging and target detection) can be successfully recovered from low-resolution measurements. We also discuss the potential system-level benefits of CS for infrared imaging, and some of the challenges that must be addressed in future infrared CS imagers designs.

Loral Infrared & Imaging Systems is developing low cost, high performance, uncooled infrared imaging products for both military and commercial applications. These products are based on the microbolometer technology, a silicon micromachined sensor which combines the wafer level silicon processing with a device structure capable of yielding excellent infrared imaging performance. Here, we report on the development of an uncooled sensor, the LTC500, which incorporates an all digital focal plane array and has a measured NETD of less than 70 mK.The focal plane array and the electronics within the LTC500 have been designed as an integrated unit to meet a broad range of end user applications by providing features such 'as nonuniformity correction, autogain and level, NTSC video, and digital outputs. The 327 x 245 element focal plane array has a 46.25 Itm pixel pitch and an on focal plane array 14 bit to analog to digital converter (ADC). The ADC has a measured instantaneous dynamic range of more than 76 dB at a 6.1 MHz output data rate and 60 Hz frame rate. The focal plane array consumes less than 500 mW of power, of which less than 250 mW is usedin the ADC-. An additional 36 dB of digital coarse offset correction in front of the ADC on the focal plane array results in a total electronic dynamic range of 112 dB. The MRT of the LTC500 camera has been measured at less 0.2 C at f0.

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