The use of two-phase flow in lab-on-chip devices, where chemical and biological reagents are enclosed within plugs separated from each other by an immiscible fluid, offers significant advantages for the development of devices with high throughput of individual heterogeneous samples. Lab-on-chip devices designed to perform the polymerase chain reaction (PCR) are a prime example of such developments. The internal circulation within the plugs used to transport the reagents affects the efficiency of the chemical reaction within the plug, due to the degree of mixing induced on the reagents by the flow regime. It has been hypothesised in the literature that all plug flows produce internal circulation. This work demonstrates experimentally that this is false. The particle image velocimetry (PIV) technique offers a powerful nonintrusive tool to study such flow fields. This paper presents micro-PIV experiments carried out to study the internal circulation of aqueous plugs in two phase flow within 762 lm internal diameter FEP Teflon tubing with FC-40 as the segmenting fluid. Experiments have been performed and the results are presented for plugs ranging in length from 1 to 13 mm with a bulk mean flow velocity ranging from 0.3 to 50 mm/s. The results demonstrate for the first time that circulation within the plugs is not always present and requires fluidic design considerations to ensure their generation.Keywords Two-phase flow Á Plug flow Á Internal circulation Á lPIV List of symbols m magnification NA numerical aperture R radius of tubing (mm) V velocity (mm/s) V avg average velocity of plug (mm/s) V max maximum velocity (mm/s) V mean bulk bulk mean velocity (mm/s) X distance (mm) Y distance (mm) d e effective diameter of particle on CCD (lm) d p diameter of particle (lm) d s point spread function (lm) n refractive index r radial position (mm)Greek symbols dx measurement uncertainty (lm) dz m measurement depth (lm) h light collection angle (rad) k 0 wavelength of light in a vacuum (nm)

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To address the requirement for prediction and understanding of airflow in forced convection cooled electronic systems, a detailed experimental investigation of the outlet flow of typical axial cooling fans has been performed. The flow is shown to be complex over much of the fans operational range, with significant radial and tangential velocities and regions with little or no flow. The effect of partially blocking a fan and running it at elevated temperatures are both shown to be significant. The effect of attaching a fan to an electronic system is then investigated. Flow drawn through a system is shown to be simple and well predicted by a standard CFD package. Flow blown into a system is far more complex, with large areas of recirculating flow, and less accuracy in the prediction. The paper gives valuable and novel design insight into forced cooling flows in electronic systems and shows that the industry is still some way from a reliable design method.

Power dissipation levels in mobile phones continue to increase due to gaming, higher power applications, and increased functionality associated with the internet. The current cooling methodologies of natural convection and radiation limit the power dissipation within a mobile phone to between 1-2 W depending on size. As power dissipation levels increase, products such as mobile phones will require active cooling to ensure that the devices operate within an acceptable temperature envelop from both user comfort and reliability perspectives. In this paper, we focus on the applied thermal engineering problem of an active cooling solution within a typical mobile phone architecture by implementing a custom centrifugal fan within the mobile phone. Its performance is compared in terms of flow rates and pressure drops, allowable phone heat dissipation and maximum phone surface temperature as this is the user constraint for a variety of simulated PCB architectures in the mobile phone. Perforated plates with varying porosity through different size orifices are used to simulate these architectures. The results show that the power level dissipated by a phone for a constant surface temperature may be increased by ~50 -75% depending on pressure drop induced by the internal phone architecture. Hence for successful implementation and efficient utilization of active cooling will require chip layout to be considered at the design stage.