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Quantitative two-dimensional maps of electrostatic potential in device structures are obtained using off-axis electron holography with a spatial resolution of 6 nm and a sensitivity of 0.17 V. Estimates of junction depth and variation in electrostatic potential obtained by electron holography, process simulation, and secondary ion mass spectroscopy show close agreement. Measurement artifacts due to sample charging and surface "dead layers" do not need to be considered provided that proper care is taken with sample preparation. The results demonstrate that electron holography could become an effective method for quantitative 2D analysis of dopant diffusion in deep-submicron devices.

In this paper, we demonstrate compatibility of hybrid, large-scale integration of both active and passive devices and components onto standard printed wiring boards in order to address mixed signal system-on-package (SOP)-based systems and applications. Fabrication, integration and characterization of high density passive components are presented, which includes the first time fabrication on FR-4 boards of a polymer buffer layer with nano scale local smoothness, blazed polymer surface relief gratings recorded by incoherent illumination, arrays of polymer micro lenses, and embedded bare die commercial p-i-n photodetectors. These embedded optical components are the essential building blocks toward a highly integrated SOP technology. The effort in this research demonstrates the potential for merging high-performance optical functions with traditional digital and radio frequency (RF) electronics onto large area and low-cost manufacturing methodologies for multifunction applications.Index Terms-optical interconnections, optical planar waveguides.

The use of lithography and electroplating to fabricate variable-reluctance, nearly planar, integrated minimotors with 6-mm-diameter rotors on silicon wafers is described. The motors consist of six electroplated Permalloy@ horseshoe-shaped cores that surround the rotor. Copper coils are formed around each core. The Permalloy and copper electroplating baths, electroplating seed layers, and through-mask plating techniques are similar to those used to fabricate inductive thin-film heads. High-aspect-ratio optical lithography or X-ray lithography was used to form the various resist layers. The rotors were fabricated separately, released from the substrate, and then slipped onto the shaft, which was plated as part of the stator fabrication process. The fabrication processes for stator and rotor are described in this paper, and initial minimotor operation data are presented.