The problem of a cracked adhesive bonded DCB-type fracture specimen has been analyzed using a hybrid stress model finite element analysis which incorporates an advanced crack tip element. Stresses in the near and far fields have been studied as a function of adherend/adhesive modulus ratio and adhesive thickness. The results are compared to monolithic systems with regard to the stress intensity factor and the localization of the singular stress domain associated with the crack tip.

No abstract

No abstract

No abstract

No abstract