In this paper, the optimal growth conditions during the physical vapour transport of bulk AlN crystals are evaluated with regard to significantly increased deep UV transparency, while maintaining the high structural quality of the AlN crystals which are grown on N-polar c-facets. We show that carbon concentration [C], oxygen concentration [O], and the ratio between both concentrations [C]/[O] have a significant influence on the deep UV transparency. At 3[C] < [O] with [C] + [O] < 1019 cm−3, deep UV transparent AlN single crystals with absorption coefficients at around 265 nm (α265nm) smaller than 15 cm−1 can be prepared. These conditions can be achieved in the N-polar grown volume parts of the AlN crystals using growth temperatures in the range of TG = 2030–2050 °C and tungsten and tantalum carbide as getter materials for carbon and oxygen, respectively. Deep UV transparent AlN substrates (α265nm < 30 cm−1) ≥10 mm in diameter and of high crystalline perfection (rocking curve FWHM < 15 arcsec) are shown for the first time
The crystal quality of bulk GaN crystals is continuously improving due to advances in GaN growth techniques. Defect characterization of the GaN substrates by conventional methods is impeded by the very low dislocation density and a large scale defect analysis method is needed. White beam synchrotron radiation x-ray topography (SR-XRT) is a rapid and non-destructive technique for dislocation analysis on a large scale. In this study, the defect structure of an ammonothermal c-plane GaN substrate was recorded using SR-XRT and the image contrast caused by the dislocation induced microstrain was simulated. The simulations and experimental observations agree excellently and the SR-XRT image contrasts of mixed and screw dislocations were determined. Apart from a few exceptions, defect selective etching measurements were shown to correspond one to one with the SR-XRT results
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