This paper presents a CMOS time-of-flight (ToF) range image sensor using high-speed lock-in pixels with background light canceling capability. The proposed lock-in pixel uses MOS gate-induced lateral electric field control of depleted potential of pinned photodiode for implementing a multiple-tap charge modulator while achieving a high-speed charge transfer for high-time resolution. A TOF image sensor with 320 x 240 effective pixels is implemented using a 0.11-µm CMOS image sensor process. The TOF sensor has a range resolution of less than 12 mm without background light and 20 mm under background line for the range from 0.8 to 1.8 m and integration time of 50 ms. The effectiveness of in-pixel background light canceling with a three-tap output pixel is demonstrated.INDEX TERMS CMOS image sensor, depth image, pinned photodiode, time-of-flight (ToF), lateral electric field charge modulator (LEFM) I. INTRODUCTION

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This paper presents an indirect time-of-flight (TOF) measurement technique with an impulse photocurrent response of a lock-in pixel. By using a short-pulse laser, the generated photocurrent can be presumed to be an impulse response. This facilitates the utilization of the full high-speed performance of the photodetector and gives high range resolution. As a proof-of-concept, a test chip with a lock-in pixel based on draining-only modulation was implemented using 0.11 μm CMOS image-sensor technology. The test chip achieved a range resolution of 0.29 mm in a 50-mm measurable range, which corresponds to a time resolution of 1.9 ps and the successful acquisition of a 3-mm example step.