A modified Taylor model, hereafter referred to as the MTCS (Mechanical-Twinning-with-Coplanar-Slip)-model, is proposed in the present work to predict weak texture components in the shear bands of brass-type fcc metals with a twin–matrix lamellar (TML) structure. The MTCS-model considers two boundary conditions (i.e., twinning does not occur in previously twinned areas and coplanar slip occurs in the TML region) to simulate the rolling texture of Cu–30%Zn. In the first approximation, texture simulation using the MTCS-model revealed brass-type textures, including Y{1 1 1} <1 1 2> and Z{1 1 1} <1 1 0> components, which correspond to the observed experimental textures. Single orientations of C(1 1 2)[1¯ 1¯ 1] and S’(1 2 3)[4¯ 1¯ 2] were applied to the MTCS-model to understand the evolution of Y and Z components. For the Y orientation, the C orientation rotates toward T(5 5 2)[1 1 5] by twinning after 30% reduction and then toward Y(1 1 1)[1 1 2] by coplanar slip after over 30% reduction. For the Z orientation, the S’ orientation rotates toward T’(3 2 1)[2 1¯ 4¯] by twinning after 30% reduction and then toward Z(1 1 1)[1 0 1¯] by coplanar slip after over 30% reduction.

Cu/SiO2 hybrid bonding has been developed for the application of heterogeneous bond interfaces in 3D integrated circuits in which thermal stability and bonding behavior are important. Thus, nano-twinned Cu (NT-Cu) is selected as the bonding material, and the thermal stability of NT-Cu and the bonding behavior of the interface between NT-Cu are investigated using a scanning electron microscope, electron backscatter diffraction, and focused ion beam. In addition to the microstructure analysis, nano-indentation and nano-scratch are employed to characterize the mechanical properties of the matrix and the interface between NT-Cu. As the bonding temperature increases from 200 to 300 °C for NT-Cu, the average grain sizes increase from 0.64 to 0.87 µm, and the rate of grain coarsening increases from 0.14 to 0.25 µm/h1/2. In addition, the fraction of voids at the bonding interface for NT-Cu interconnects decreases from 0.814% to 0.005%, and the penetration depth increases from 228 to 745 nm with an increase in the temperature from 200 to 300 °C. The hardness of the bonding interface obtained by nano-scratch and nano-indentation array testing is ∼1.8 GPa.

Herein, the nucleation instability criteria and nonuniform mobility are considered in the 2D cellular automaton simulation to investigate the recrystallization texture of cold‐rolled AA1100. Under the consideration of mechanical instability, the critical driving force for nucleation depends on the differences of the stored energy between a center cell and the neighboring cells. The possible nucleation sites are reduced to 37.5% in comparison with the nucleation model using a constant value of the driving force. The simulation of nucleation reveals that the mechanical instability promotes the formation of recrystallization textures at the expense of neighboring grains with orientations of deformation textures. The nonuniform mobility of high‐angle grain boundaries is implemented in simulation of recrystallization. The enhanced mobility of high‐angle grain boundaries with misorientation of 40°/<111> significantly promotes the growth of grains with orientations of Cube and RC20°RD (recrystallization textures) and inhibits the growth of grain with orientations of C, S, and B (deformation textures).

In the present work, we take the influences of activated slip systems and the orientation spread into account to predict the cup height using analytical earing models and compare the predicted results with experimental results. The effect of boundary conditions of the various stress states and the work hardening exponents are compared and discussed for profile of single crystals. A stress ratio of −0.3 and a hardening exponent of 0.3 are selected for the prediction of earing profiles. The combination of activation of the single slip systems and orientation spread provides the best prediction of deep-drawing profiles. With further consideration of the orientation spread, an increase in the total orientation leads to peak-broadening, i.e., broad and smooth ears. Furthermore, the difference of the height between the maximum and minimum value of cup profiles is reduced because of the orientation spread. The profile for C is found with single ear at 45°, while the other components individually reveal double ears at 35° and 50° for S, at 15° and 45° for B, at 0° and 90° for Cube, at 5° and 90° for r-Cube, and at 15° and 90° for G. Herein, simple analytical earing models are proposed to understand the effects of slip systems and the orientation spread. The deep-drawing profiles are predicted with six major texture components.

In this study, the competition mechanisms between dislocation slip and twinning in silver with a low stacking fault energy using molecular dynamics (MD) simulation from an atomistic point of view are reported. Herein, three crystallographic surface orientations of , , and are considered and compared. The indentation stress–strain curves are successfully obtained from the load–displacement curves of nanoindentation. The stress of , , and orientations drops at the strains of 0.140, 0.133, and 0.136, which corresponds to the yield stress of 3.83, 4.33, and 4.99 GPa, respectively. Dislocation slip and twinning simultaneously form in silver as indicated by the total potential energy of the system. Furthermore, the typical four‐, two‐, and sixfold symmetries of the out‐of‐plane displacement as in copper are not observed for , , and orientations in silver. Hence, this observation can be supported by the simultaneous occurrence of dislocation slip and twinning in silver.