An object viewed from different angles can be recognized and distinguished from similar distractors after the viewer has had experience watching it rotate. It has been assumed that as an observer watches the rotation, separate representations of individual views become associated with one another. However, we show here that once monkeys learned to discriminate individual views of objects, they were able to recognize objects across rotations up to 60 degrees , even though there had been no opportunity to learn the association between different views. Our results suggest that object recognition across small or medium changes in viewing angle depends on features common to similar views of objects.

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A newly designed microwave electron cyclotron resonance (ECR) plasma etching reactor has been developed for 450 mm wafer processing. The etching rates of polycrystalline silicon (poly-Si) and SiO 2 across the wafer were evaluated as a function of ECR position. Two-dimensional (radial and vertical) distributions of the ion flux in the reactor were also investigated using a movable single probe system. A ring-shaped region of highdensity plasma along the ECR plane was observed. This reveals the mechanism that the etching-rate distribution could be controlled by the ECR position. As a result, a polycrystalline silicon etching rate uniformity of 1.5% across a wafer was successfully obtained. Furthermore, the uniformity control of critical dimensions (CDs) based on wafer temperature was also investigated, and CD uniformity below 3 nm across the wafer was obtained in the optimum temperature distribution. #

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