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In this study, we analyzed the crystallinity of c-axis aligned crystalline In–Ga–Zn oxide (CAAC-IGZO) and single crystalline (sc) IGZO films. CAAC-IGZO films were formed on (111)-oriented yttria-stabilized-zirconia substrates by magnetron sputtering using a target. Sc-IGZO films were obtained by annealing CAAC-IGZO films at 1200 °C. The proportion of Zn in the composition changed during growth of the films, and as a result, sc-InGaO3(ZnO)3 films were obtained. By using CAAC-IGZO films as the starting material, sc-IGZO films were formed even without a ZnO layer. This is presumably because the CAAC-IGZO film originally exhibits c-axis orientation. In addition, the characteristics of transistors fabricated using sc-IGZO and CAAC-IGZO films were compared, and no significant difference in current drivability, i.e., field-effect mobility, was observed between the different transistors. In this sense, CAAC-IGZO films that require no high temperature annealing are favorable for industrialization.

A channel length of a c-axis aligned crystal indium gallium zinc oxide (CAAC-IGZO) transistor having low off-state current at a yA/µm level was decreased to 100 nm, and the electrical characteristics and short-channel effect of the CAAC-IGZO transistor were researched. As a result, we found that, in the CAAC-IGZO transistor with L = 100 nm, even with a gate insulator film having an equivalent oxide thickness (EOT) = 11 nm, an extremely small off-state current of 380 yA/µm at 85 °C is maintained, in addition channel length dependence of the electrical characteristics is hardly seen. Favorable values of characteristics of the CAAC-IGZO transistor can be obtained, such as subthreshold slope (SS) = 77 mV/dec, drain induced barrier lowering (DIBL) = 73 mV/V, threshold voltage (V th) = 0.65 V, and on-state current (I on) = 65 µA/µm. These results suggest the possibility that the CAAC-IGZO transistor can be applied to an LSI in a deep submicron region.

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