The climbing microrobots have attracted growing attention due to their promising applications in exploration and monitoring of complex, unstructured environments. Soft climbing microrobots based on muscle-like actuators could offer excellent flexibility, adaptability, and mechanical robustness. Despite the remarkable progress in this area, the development of soft microrobots capable of climbing on flat/curved surfaces and transitioning between two different surfaces remains elusive, especially in open spaces. In this study, we address these challenges by developing voltage-driven soft small-scale actuators with customized 3D configurations and active stiffness adjusting. Combination of programmed strain distributions in liquid crystal elastomers (LCEs) and buckling-driven 3D assembly, guided by mechanics modeling, allows for voltage-driven, complex 3D-to-3D shape morphing (bending angle > 200°) at millimeter scales (from 1 to 10 mm), which is unachievable previously. These soft actuators enable development of morphable electroadhesive footpads that can conform to different curved surfaces and stiffness-variable smart joints that allow different locomotion gaits in a single microrobot. By integrating such morphable footpads and smart joints with a deformable body, we report a multigait, soft microrobot (length from 6 to 90 mm, and mass from 0.2 to 3 g) capable of climbing on surfaces with diverse shapes (e.g., flat plane, cylinder, wavy surface, wedge-shaped groove, and sphere) and transitioning between two distinct surfaces. We demonstrate that the microrobot could navigate from one surface to another, recording two corresponding ceilings when carrying an integrated microcamera. The developed soft microrobot can also flip over a barrier, survive extreme compression, and climb bamboo and leaf.

Electronic devices with engineered three-dimensional (3D) architectures are indispensable for frictional-force sensing, wide-field optical imaging, and flow velocity measurement. Recent advances in mechanically guided assembly established deterministic routes to 3D structures in high-performance materials, through controlled rolling/folding/buckling deformations. The resulting 3D structures are, however, mostly formed on planar substrates and cannot be transferred directly onto another curved substrate. Here, we introduce an ordered assembly strategy to allow transformation of 2D thin films into sophisticated 3D structures on diverse curved surfaces. The strategy leverages predefined mechanical loadings that deform curved elastomer substrates into flat/cylindrical configurations, followed by an additional uniaxial/biaxial prestretch to drive buckling-guided assembly. Release of predefined loadings results in an ordered assembly that can be accurately captured by mechanics modeling, as illustrated by dozens of complex 3D structures assembled on curved substrates. Demonstrated applications include tunable dipole antennas, flow sensors inside a tube, and integrated electronic systems capable of conformal integration with the heart.

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Recently developed buckling-guided assembly methods provide a unique route to the design and manufacture of 3D mesostructures and microelectronic devices with superior performances and unusual functions. Combined with loading-path controlled strategies and/or active materials designs, reconfigurable 3D mesostructures with multiple stable 3D geometries can be formed, with promising applications in tunable antennas and multimodal actuators. The existing strategies are, however, limited by the applicable range of material types or requirements for switching between various complicated loading paths. Here, we present an electroadhesion-mediated strategy to achieve controlled adhesion of the 3D mesostructure to the substrate during the buckling-guided assembly. This strategy allows an active control of the delamination behavior in the film/substrate system, such that a variety of reconfigurable 3D mesostructures can be accessed by designing the electrode layout and strain-dependent voltage. An electromechanical model is developed to capture the delamination behavior of the film/substrate system under combined compression and voltage loadings, which is in excellent agreements with experimental measurements. Based on this model, an equivalent interface energy is proposed to quantify the contributions of the electroadhesion and van der Waals' interactions, which also facilitates simulations of the interface delamination with cohesive models in finite element analyses (FEA). Furthermore, a variety of reconfigurable 3D mesostructures are demonstrated experimentally, which agree well with FEA predictions using the concept of equivalent interface energy.

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