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The drive for miniaturization of electronic packaging is continuing relentlessly due to ever more functionality in smaller, lighter mobile products. Consequently, innovations are required in packaging technology, and more importantly, in enabled volume manufacturing. Some recent trends in thin products and packaging will be high-lighted and compared to the JEDEC standards for packages. The ASE roadmaps for package size reductions will be presented with particular focus on prepreg based substrate technology. A single sided substrate has been developed and is currently shipping in high volume. The manufacturing concept for this substrate has been adapted to build coreless substrates based on prepreg which are currently in characterization. Further adaptation has led to embedded component, actives and passives, substrates which are currently in qualification. For the later, a new manufacturing form factor has been chosen to take advantage of the assembly infrastructure and to maximize the yield of the substrate which is a key factor for the commercial success of this technology. ASE is offering these substrates in full turnkey service from wafer sort to bumping to embedding in the substrate to assembly of top components, balling and final test.

The significantly increasing transmission capacity in the subscriber system are accelerating demands for higher data transmission speed, low cost, and system miniaturization in the millennium approaches. The key solution for the demands, smaller, lower cost, and high performance package, is surface mount technology. OptoBGATM package has been developed to meet this challenge, a surface mountable type optical package that is designed for high frequency transmission speeds.OptoBGATM package has a BGA structure to bring forth effectively size and cost reduction for the packaging.OptoBGATM consists of ceramic material, a robust material, which has many advantages such as design flexibility with fine design rule, ease of process technology, high performance, and high reliability. The design of OptoBGATM was made possible by improvement in the physical structure.The results of this research produced an OptoBGATM with a return loss of about -20dB at 1 0GHz (the measurement is taken from IC pattern mounted inside the package to I/O terminal). Furthermore, reliability test evaluations have been conducted to demonstrate that the OptoBGATM can withstand harsh environments.

The Embedded die in substrate (EDS) market has grown significantly over the past several years and it is now one of the fastest growing packaging technologies in the semiconductor industry driven by smaller form factor, better heat dissipating, low noise emission, higher levels of integration and better performance. In addition, for power management and mobilewireless application the embedded technology had been evaluated to replace assembles fabrication not only thinner thickness but superior electrical performance. However, Embedded Die causes severe package warpage issue due to CTE mismatch happened on diffusion bond process.In this work, the three Dimensional Warpage Metrology Analyzer (3D-WMA), as a non-contact optical deformation measurement method used to measure unit package warpage behavior with different temperatures. Reducing the warpage issue of package, the parametric factors on the structure and material would be investigated. These design guides are then studied by finite element modeling to understand mechanism for warpage improvement and the dielectric material property selection is critically factoring for warpage control. The measured warpage data agrees very well with the predicted one that the maximum discrepancy is within 3%. Based on the above justification, it starts to carry out the parametric study. Initially, changed prepreg can improve the warpage 64%. Besides, Cu layer should be thick and soldermask layer should be thin. Furthermore, asymmetric structure design of cu layer and soldermask layer is another effective for warpage reduction. Impact from structural design and material property selection is studied in this paper.

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