Results of room temperature Raman scattering studies of ultrathin graphitic films supported on Si (111)/SiO 2 substrates are reported. The results are significantly different from those known for graphite. Spectra were collected using 514 nm radiation on films containing from n=1 to 20 graphene layers, as determined by atomic force microscopy. Both the 1 st and 2 nd order Raman spectra show unique signatures of the number of layers in the film. The nGL film analog of the Raman G-band in graphite exhibits a Lorentzian lineshape whose center frequency shifts linearly relative to graphite as ~1/n (for n=1 ω G~1 588 cm -1 ). Three weak bands, identified with disorder-induced 1 st order scattering, are observed at ~ 1350, 1450 and 1500 cm -1 . The 1500 cm -1 band is weak but relatively sharp and exhibits an interesting n-dependence. In general, the intensity of these D-bands decreases dramatically with increasing n. Three 2 nd order bands are also observed (~2450, ~2700 and 3248 cm -1 ). They are analogs to those observed in graphite. However, the ~2700 cm -1 band exhibits an interesting and dramatic change of shape with n. Interestingly, for n<5 this 2 nd order band is more intense than the G-band.

Results are presented from an experimental and theoretical study of the electronic properties of back-gated graphene field effect transistors (FETs) on Si/SiO(2) substrates. The excess charge on the graphene was observed by sweeping the gate voltage to determine the charge neutrality point in the graphene. Devices exposed to laboratory environment for several days were always found to be initially p-type. After approximately 20 h at 200 degrees C in approximately 5 x 10(-7) Torr vacuum, the FET slowly evolved to n-type behavior with a final excess electron density on the graphene of approximately 4 x 10(12) e/cm(2). This value is in excellent agreement with our theoretical calculations on SiO(2), where we have used molecular dynamics to build the SiO(2) structure and then density functional theory to compute the electronic structure. The essential theoretical result is that the SiO(2) has a significant surface state density just below the conduction band edge that donates electrons to the graphene to balance the chemical potential at the interface. An electrostatic model for the FET is also presented that produces an expression for the gate bias dependence of the carrier density.

Over the past two decades, several advances have been made in micromachined sensors and actuators. As the field of microelectromechanical systems (MEMS) has advanced, a clear need for the integration of materials other than silicon and its compounds into micromachined transducers has emerged. Piezoelectric materials are high energy density materials that scale very favorably upon miniaturization and that has led to an ever-growing interest in piezoelectric films for MEMS applications. At this time, piezoelectric aluminum-nitride-based film bulk acoustic resonators (FBAR) have already been successfully commercialized. Future innovations and improvements in inertial sensors for navigation, high-frequency crystal oscillators and filters for wireless applications, microactuators for RF applications, chip-scale chemical analysis systems and countless other applications hinge upon the successful miniaturization of components and integration of piezoelectrics and metals into these systems. In this article, a comprehensive review of micromachined piezoelectric transducer technology will be presented. Piezoelectric materials in bulk and thin film forms will be reviewed and fabrication techniques for the integration of these materials for microsensor applications will be presented. Recent advances in various piezoelectric microsensors will be presented through specific examples. This review will conclude with a critical assessment of the future trends and promise of this technology.

We have studied the intrinsic doping level and gate hysteresis of graphene-based field effect transistors (FETs) fabricated over Si/SiO(2) substrates. It was found that the high p-doping level of graphene in some as-prepared devices can be reversed by vacuum degassing at room temperature or above depending on the degree of hydrophobicity and/or hydration of the underlying SiO(2) substrate. Charge neutrality point (CNP) hysteresis, consisting of the shift of the charge neutrality point (or Dirac peak) upon reversal of the gate voltage sweep direction, was also greatly reduced upon vacuum degassing. However, another type of hysteresis, consisting of the change in the transconductance upon reversal of the gate voltage sweep direction, persists even after long-term vacuum annealing at 200 °C, when SiO(2) surface-bound water is expected to be desorbed. We propose a mechanism for this transconductance hysteresis that involves water-related defects, formed during the hydration of the near-surface silanol groups in the bulk SiO(2), that can act as electron traps.