S. Skorobogatov and R. Anderson identified laser illumination as an effective technique to conduct fault attacks in 2002. In these early days of laser-induced fault injection, it was proven to be possible to inject single-bit faults into integrated circuits. This corresponds to the more restrictive fault model found in the fault attack bibliography. The target area under laser illumination (a few micrometers, down to ∼ 1 µm) broadly matched that of a single transistor. It was consistent with a singlebit fault model. However, since then the technology of secure devices has evolved. In current circuits even the smallest laser spots may illuminate several logic cells. This raises the question of the validity of the single-bit fault model: does it still hold? In this work, we report an assessment of its validity through experimental results obtained from circuits designed at the 28 nm CMOS technology node. We also describe the main properties of the corresponding fault model obtained from both static and dynamic experiments.

The use of a laser as a means to inject errors during the computations of a secure integrated circuit (IC) for the purpose of retrieving secret data was first reported in 2002. Since then, a lot of research work, mainly experimental, has been carried out to study this threat. This paper reports research conducted, in the framework of the french national project LIESSE, to obtain an electrical model of the laser effects on CMOS ICs. Based on simulation, a first model permitted us to draw the laser sensitivity map of a SRAM cell. It demonstrates a very close correlation with experimental measures. We also introduce the preliminary results we gathered to build a similar electrical model for FD-SOI circuits. FD-SOI technology is expected to be less sensitive to laser than CMOS.

Abstract. Lasers have become one of the most efficient means to attack secure integrated systems. Actual faults or errors induced in the system depend on many parameters, including the circuit technology and the laser characteristics. Understanding the physical effects is mandatory to correctly evaluate during the design flow the potential consequences of a laser-based attack and implement efficient counter-measures. This paper presents results obtained within the LIESSE project, aiming at defining a comprehensive approach for designers. Outcomes include the definition of fault/error models at several levels of abstraction, specific CAD tools using these models and new counter-measures well-suited to thwart laser-based attacks. Actual measures on components manufactured in the new 28 nm FDSOI technology are also presented.

No abstract